公开(公告)号：US20190028073A1

公开(公告)日：2019-01-24

申请号：US16036137

申请日：2018-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Gon GHIM ,  Nam-Woo KIM ,  Dong-Han KIM ,  Tae-Il KIM

IPC: H03F3/24 ,  H04W72/04

Abstract: Disclosed is an electronic device including: a communication circuit; and a processor operationally connected to the communication circuit, where the processor is configured to use the communication circuit to merge a first transmission signal of a first communication scheme corresponding to a first band that is one of transmission bands of the first communication scheme and a second transmission signal of a second communication scheme corresponding to a second band that is one of the transmission bands, amplify the merged first transmission signal and second transmission signal using a power amplifier, transmit the amplified first transmission signal to a first external electronic device communicating in the first communication scheme, and transmit the amplified second transmission signal to a second external electronic device communicating in the second communication scheme. Other various embodiments are possible.

公开(公告)号：US20180288716A1

公开(公告)日：2018-10-04

申请号：US15944378

申请日：2018-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Gon GHIM ,  Namwoo KIM ,  Jongsam PARK ,  Hwi SONG

IPC: H04W52/48 ,  H04W52/38

Abstract: An electronic device according to various embodiments may include at least one transceiver, and at least one processor, operatively coupled to the at least one transceiver, configured to control to transmit, via a device-to-device (D2D) communication path to at least another electronic device, a signal with a first transmit (Tx) power, and control to re-transmit, via the D2D communication path to the at least another electronic device, the signal with a second Tx power lower than the first Tx power.