公开(公告)号：US20180122845A1

公开(公告)日：2018-05-03

申请号：US15602185

申请日：2017-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun Hyung KIM ,  Seokho KIM ,  SungHyup KIM ,  Jaegeun KIM ,  Taeyeong KIM

IPC: H01L27/146

CPC classification number: H01L27/1469 ,  H01L21/2007 ,  H01L24/01 ,  H01L24/03 ,  H01L24/04 ,  H01L24/74 ,  H01L24/80 ,  H01L27/14634 ,  H01L27/14683 ,  H01L27/14687

Abstract: Disclosed are a substrate bonding apparatus and a method of manufacturing a semiconductor device. The substrate bonding apparatus comprises vacuum pumps, a first chuck engaged with the vacuum pumps and adsorbing a first substrate at vacuum pressure of the vacuum pumps, and a pushing unit penetrating a center of the first chuck and pushing the first substrate away from the first chuck. The first chuck comprises adsorption sectors providing different vacuum pressures in an azimuth direction to the first substrate.