公开(公告)号：US20240298787A1

公开(公告)日：2024-09-12

申请号：US18236691

申请日：2023-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghyeok Kim ,  Jeongmin Na

IPC: A46B9/02 ,  B08B1/00 ,  B08B1/04

CPC classification number: A46B9/026 ,  B08B1/12 ,  B08B1/32 ,  A46B2200/3073

Abstract: A wafer cleaning brush includes a rotatable core, a brush body surrounding an outer circumferential surface of the core, and a plurality of protrusions disposed on a brush body surface, where a pitch of the plurality of protrusions in a length direction of the brush body may be in a range of 11 mm to 15 mm, and where, for each of the plurality of protrusions, a value obtained by dividing a long side of the brush body in the length direction by the pitch is below 0.55.

公开(公告)号：US20240148133A1

公开(公告)日：2024-05-09

申请号：US18204971

申请日：2023-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongmin Na ,  Songyun Kang ,  Sungyong Park

IPC: A46B9/06 ,  A46B9/02 ,  A46D1/00

CPC classification number: A46B9/06 ,  A46B9/026 ,  A46D1/02 ,  A46B2200/3073

Abstract: A brush for cleaning a wafer includes a core extending lengthwise in a first direction, a brushing roller arranged on an outer circumferential surface of the core and having a first region and a second region defined at an outer circumferential surface of the brushing roller, a plurality of first brushing bristles extending from the first region in a radial direction of the brushing roller, wherein the radial direction of the brushing roller is perpendicular to the first direction, and a plurality of second brushing bristles extending from the second region in the radial direction of the brushing roller. Each of the plurality of first brushing bristles has a first shape, and each of the plurality of second brushing bristles has a second shape different from the first shape.