公开(公告)号：US11019388B2

公开(公告)日：2021-05-25

申请号：US16587531

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik Choi ,  Jungrae Kim ,  Jinyong Park ,  Hyunyong Choi ,  Dongwook Han ,  Jina Kwon ,  Hayeon Kil ,  Kyoungmin Kim ,  Youngjin Kim ,  Sungyong Park ,  Siyoung Park ,  Yongwoo Shin ,  Daesik Yoon ,  Eunjoo Cho ,  Jungyon Cho

IPC: H04N21/422 ,  G06F3/14 ,  G06F3/16

Abstract: A display device and a method capable of rotating a display based on a type of a user command are provided. The display device according to the disclosure receives a user command while first content is displayed on the display, the display being configured to operate in a first orientation while displaying the first content, maintains the display to operate in the first orientation when the received user command is a command to control a feature corresponding to the first content, determines, based on a type of a second content, to control the display to operate in the first orientation or a second orientation different from the first orientation when the received user command is a command to display the second content on the display, and controls the motor to rotate the display based on the determined first orientation or the second orientation.

公开(公告)号：US20240399532A1

公开(公告)日：2024-12-05

申请号：US18524745

申请日：2023-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung Choi ,  Wonuk Yoon ,  Jaemook Kang ,  Keonwoo Kim ,  Sungyong Park ,  Hoseop Choi ,  Seonmin Yun ,  Jitae Lee

IPC: B24B41/047 ,  B24B37/20

Abstract: A polishing head of a CMP apparatus may include a head block, a distribution block and a segmentation type head module. The head block may configured to be positioned over a substrate. The distribution block may be rotatably connected to a lower surface of the head block with respect to a vertical direction. A plurality of pressure lines may be connected to the distribution block and configured to flow a working fluid therethrough. The segmentation type head module may be connected to the lower surface of the distribution block. The segmentation type head module may be configured to rotate with respect to the vertical direction together with the distribution block. The segmentation type head module may be configured to locally pressurize the substrate using the working fluid provided through the pressure lines.

公开(公告)号：US20240148133A1

公开(公告)日：2024-05-09

申请号：US18204971

申请日：2023-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongmin Na ,  Songyun Kang ,  Sungyong Park

IPC: A46B9/06 ,  A46B9/02 ,  A46D1/00

CPC classification number: A46B9/06 ,  A46B9/026 ,  A46D1/02 ,  A46B2200/3073

Abstract: A brush for cleaning a wafer includes a core extending lengthwise in a first direction, a brushing roller arranged on an outer circumferential surface of the core and having a first region and a second region defined at an outer circumferential surface of the brushing roller, a plurality of first brushing bristles extending from the first region in a radial direction of the brushing roller, wherein the radial direction of the brushing roller is perpendicular to the first direction, and a plurality of second brushing bristles extending from the second region in the radial direction of the brushing roller. Each of the plurality of first brushing bristles has a first shape, and each of the plurality of second brushing bristles has a second shape different from the first shape.

公开(公告)号：US11456195B2

公开(公告)日：2022-09-27

申请号：US16751882

申请日：2020-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho Hwang ,  Sungyong Park ,  Eunseok Seo ,  Hyeongseok Jo ,  Seok Heo

IPC: H01L21/67 ,  G05D16/20 ,  H05B1/02 ,  G05D23/19 ,  G05B19/418 ,  C23C14/54

Abstract: A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.

公开(公告)号：US20240269798A1

公开(公告)日：2024-08-15

申请号：US18402471

申请日：2024-01-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyuntae Lee ,  Domin Kim ,  Sungyong Park ,  Jubong Lee ,  Jaemin Jung ,  Hoseop Choi

IPC: B24B37/20

CPC classification number: B24B37/20

Abstract: A conditioning apparatus includes an arm configured to be rotated by an actuator, a gimbaling part disposed at one end of the arm and disposed such that a lower end thereof protrudes outwardly of the arm and an abrasive disc is installed thereon, a frame unit connected to the gimbaling part, a rotation driving unit connected to the gimbaling part and configured to transfer driving force for rotating the abrasive disc, a load applying unit connected to the frame unit and configured to elevate the frame unit, and a universal joint connecting the gimbaling part to the rotation driving unit, wherein the universal joint separates a center of gravity of the rotation driving unit from a center of gravity of the gimbaling part.

公开(公告)号：US20240412984A1

公开(公告)日：2024-12-12

申请号：US18810623

申请日：2024-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ansook Sul ,  Sungyong Park ,  Sejin Park ,  Donok Choi

IPC: H01L21/67 ,  B08B3/12 ,  B08B7/00 ,  H01L21/02 ,  H01L21/687

Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.

公开(公告)号：US12119240B2

公开(公告)日：2024-10-15

申请号：US18081948

申请日：2022-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ansook Sul ,  Sungyong Park ,  Sejin Park ,  Donok Choi

IPC: H01L21/00 ,  B08B3/12 ,  B08B7/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67034 ,  B08B3/12 ,  B08B7/0021 ,  H01L21/02101 ,  H01L21/68785

Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.

公开(公告)号：US20230380111A1

公开(公告)日：2023-11-23

申请号：US18230517

申请日：2023-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseok LEE ,  Heecheul Moon ,  Sungyong Park

IPC: H05K7/20 ,  H05K5/03 ,  H05K5/04

CPC classification number: H05K7/2039 ,  H05K5/03 ,  H05K5/04

Abstract: According to various embodiments, an electronic device includes: a housing; a support member which is disposed in the inner space of the housing, and which includes a first surface oriented in a first direction and a second surface oriented in a second direction that is opposite to the first surface; at least one pattern formed to have a length in a designated direction in at least a part of the first surface and/or the second surface of the support member; and a heat dissipation coating layer stacked on the first surface and/or the second surface on which the at least one pattern is formed, wherein the at least one pattern may include a plurality of recesses spaced apart from each other at designated intervals and formed on the first surface and/or the second surface.

公开(公告)号：US20230187231A1

公开(公告)日：2023-06-15

申请号：US18081948

申请日：2022-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ansook Sul ,  Sungyong Park ,  Sejin Park ,  Donok Choi

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/12 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67034 ,  B08B7/0021 ,  B08B3/12 ,  H01L21/02101 ,  H01L21/68785

Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.

公开(公告)号：US11590460B2

公开(公告)日：2023-02-28

申请号：US17239644

申请日：2021-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonguk Seo ,  Sungyong Park ,  Hongju Kim ,  Ansook Sul ,  Seok Heo ,  Yinghu Xu

IPC: B01F23/10 ,  B01F23/231 ,  B01F101/56

Abstract: A chemical solution vaporization device includes a chemical solution tank including chemical solution vaporization rooms, a chemical solution sensing room, and a chemical solution supply room. A first internal wall separating the plurality of chemical solution vaporization rooms from each other includes a first opening at a lower portion thereof. A second internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution supply room includes a second opening at a lower portion thereof. A third internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution sensing room includes a third opening at a lower portion thereof. And a lower portion of a fourth internal wall separating the chemical solution sensing room from the chemical solution supply room is combined with the lower wall.