公开(公告)号：US20230146301A1

公开(公告)日：2023-05-11

申请号：US17983279

申请日：2022-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongbo KIM ,  Jiho LIM ,  Hyungki PARK ,  Sungyoung HEO

IPC: B32B15/20 ,  C22C21/00 ,  C25D11/12 ,  C25D11/16 ,  C25D11/24

CPC classification number: B32B15/20 ,  C22C21/00 ,  C25D11/12 ,  C25D11/16 ,  C25D11/243 ,  C25D11/246 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2311/24 ,  B32B2457/20

Abstract: An electronic device according to various embodiments of the disclosure includes: a display; and a housing adjacent to the display, wherein at least a part of the housing includes: an aluminum alloy layer; a first film layer formed on the aluminum alloy layer; and a second film layer formed between the aluminum alloy layer and the first film layer and which includes multiple snowflake structures arranged adjacent to the first film layer. The first film layer is formed by a first anodizing process using a first voltage on the aluminum alloy layer, and the second film layer is formed by a second anodizing process using a second voltage on the aluminum alloy layer after the first anodizing process.

公开(公告)号：US20230040926A1

公开(公告)日：2023-02-09

申请号：US17876477

申请日：2022-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungyoung HEO ,  Hyungki PARK ,  Jongbo KIM ,  Jiho LIM ,  Youngsoo JUNG

IPC: G06F1/16 ,  C23F13/00 ,  C23F3/02

Abstract: An electronic device according to various embodiments of the disclosure may include: a display; and a housing including the display, at least a portion of the housing including: an aluminum alloy machined to have a designated shape; a first film layer formed on the aluminum alloy; and a second film layer formed between the aluminum alloy and the first film layer, wherein the first film layer may be formed by a first anodizing process using a first voltage on the aluminum alloy, and the second film layer may be formed by a second anodizing process using a second voltage on the aluminum alloy after the first anodizing process.