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公开(公告)号:US20190072903A1
公开(公告)日:2019-03-07
申请号:US16115683
申请日:2018-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sung-Eun PARK , Jong-Chun WEE , Wook-Jin LEE , Jae-Uk AHN
CPC classification number: G04B37/08 , G04G13/00 , G04G17/02 , G04G17/04 , G04G17/08 , H04R1/023 , H04R1/025 , H04R1/1041 , H04R1/44 , H04R2420/07 , H04R2420/09 , H05K5/061
Abstract: An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.