SEMICONDUCTOR MANUFACTURING APPARATUS
    1.
    发明公开

    公开(公告)号:US20240120234A1

    公开(公告)日:2024-04-11

    申请号:US18376862

    申请日:2023-10-05

    CPC classification number: H01L21/68742 H01L21/67309 H01L21/67373

    Abstract: A semiconductor manufacturing apparatus includes a first structure having a first hole, a second structure on the first structure, the second structure including a space for accommodating a substrate and a lower plate with a second hole, a first pin insertable into the first hole, the first pin having a same diameter as the first hole and a length smaller than a length of the first hole in a vertical direction, a second pin insertable into the second hole and on the first pin, the second pin having a same diameter as the second hole, a locking plate between the first pin and the second pin, the locking plate overhanging a side wall of the first pin, and a coupling member configured to couple the first pin to or separate the first pin from the second pin.

    IMAGING SYSTEM AND IMAGING INSPECTION APPARATUS INCLUDING THE SAME

    公开(公告)号:US20250076204A1

    公开(公告)日:2025-03-06

    申请号:US18623629

    申请日:2024-04-01

    Abstract: An imaging system that includes a first polarization structure that polarizes light provided from a light source into first polarized light, a first power supply connected to the first polarization structure and that applies a first voltage to the first polarization structure, a meta-lens on which the first polarized light is incident, a second polarization structure that converts the first polarized light that passes through the meta-lens into second polarized light, a second power supply connected to the second polarization structure and that applies a second voltage to the second polarization structure, and an image sensor that senses the second polarized light. The first voltage and the second voltage are different from each other.

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