IMAGING SYSTEM AND IMAGING INSPECTION APPARATUS INCLUDING THE SAME

    公开(公告)号:US20250076204A1

    公开(公告)日:2025-03-06

    申请号:US18623629

    申请日:2024-04-01

    Abstract: An imaging system that includes a first polarization structure that polarizes light provided from a light source into first polarized light, a first power supply connected to the first polarization structure and that applies a first voltage to the first polarization structure, a meta-lens on which the first polarized light is incident, a second polarization structure that converts the first polarized light that passes through the meta-lens into second polarized light, a second power supply connected to the second polarization structure and that applies a second voltage to the second polarization structure, and an image sensor that senses the second polarized light. The first voltage and the second voltage are different from each other.

    ELECTRONIC DEVICE
    2.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240361395A1

    公开(公告)日:2024-10-31

    申请号:US18347293

    申请日:2023-07-05

    CPC classification number: G01R31/388 G01R31/3646 H01M10/48 H02J7/0048

    Abstract: An electronic device may comprise a battery configured to supply power, and processing circuitry configured to, calculate a state of charge (SOC) calculated value of the battery based on sensed battery condition information of the battery, generate an SOC reported value, which fluctuates between a desired first value and a desired second value, wherein the desired second value is lower than the desired first value, based on at least one of the SOC calculated value, a charging status of the battery, a fully charged voltage of the battery, and a fully discharged voltage of the battery, and control the electronic device based on the SOC reported value.

    APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF

    公开(公告)号:US20230102791A1

    公开(公告)日:2023-03-30

    申请号:US17740494

    申请日:2022-05-10

    Abstract: A method for dicing a substrate includes setting a target height for forming a first reforming region inside a target substrate, the target height being a distance from an upper surface of the target substrate to the first reforming region; irradiating a laser beam to a first sample substrate including a first film and a second film being in contact with the first film, and setting a target condition on the basis of a sample condition that results in forming a condensing point of the laser beam on an upper surface of the first film being in contact with the second film; and irradiating the target substrate with the laser beam according to the target condition to form the first reforming region inside the target substrate, wherein a thickness of the second film is the target height.

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