ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE INCLUDING THEREOF

    公开(公告)号:US20230111297A1

    公开(公告)日:2023-04-13

    申请号:US17990858

    申请日:2022-11-21

    Abstract: An electronic device and housing are disclosed herein. The electronic device includes a plurality of electronic components housed within the housing. The housing includes a substrate, a transparent coating layer formed on a front surface of the substrate, a deposition layer formed on a rear surface of the substrate, wherein the front surface of the substrate includes a first protrusion extending in a first direction outwards from the substrate, wherein the rear surface of the substrate includes a second protrusion extending in a second direction opposite to the first direction, wherein the first protrusion and the second protrusion differ in at least one their respective widths, depths or pitches, and wherein a first focal length of the first protrusion and a second focal length of the second protrusion are different from each other.

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