公开(公告)号：US20230038052A1

公开(公告)日：2023-02-09

申请号：US17864979

申请日：2022-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hangyu HWANG ,  Changsu KIM ,  Sangsik NA ,  Yeonghwan GONG ,  Hyunjung JUNG ,  Sungho CHO ,  Junpil KIM ,  Jinho KIM ,  Jinshik LIM ,  Jungho HWANG

IPC: H04M1/02

Abstract: According to certain embodiments, an electronic device housing comprises: a substrate including: a front surface comprising a plurality of front surface protrusions and a plurality of taper protrusions protruding from the plurality of front surface protrusions and a rear surface comprising a plurality of rear surface protrusions; and wherein two protrusions selected from the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions are different from each remaining ones of the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions; a deposition layer formed on the front surface of the substrate; and a transparent coating layer formed on the rear surface of the substrate.