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公开(公告)号：US10770801B2
公开(公告)日：2020-09-08
申请号：US16251763
申请日：2019-01-18
Inventor： Jaeseok Park , Yeeun Chi , Seongook Park , Sungbum Park , Seongjin Park , Sanghyuk Wi , Youngho Ryu , Taewan Kim
Abstract: An antenna structure is provided. The antenna structure includes at least one feeder, a plurality of dielectric substrates, a plurality of conductive plates disposed between the plurality of dielectric substrates, the plurality of conductive plates including at least one opening, and a radiator electrically connected to the at least one feeder through conductive vias in the plurality of dielectric substrates and the plurality of conductive plates. The radiator includes a plurality of first parasitic conductive plates spaced apart from each other, and a second parasitic conductive plate disposed between the plurality of first parasitic conductive plates, the second parasitic conductive plate being spaced apart from the plurality of first parasitic conductive plates.
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Patent Agency Ranking
公开(公告)号：US11742587B2
公开(公告)日：2023-08-29
申请号：US17581044
申请日：2022-01-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jungi Jeong , Chanju Park , Junhwa Oh , Sanghyuk Wi
CPC classification number: H01Q21/0025 , H01Q1/2283 , H01Q1/243 , H01Q21/064
Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub. The short stub structure designed on a second layer different from the first layer having the open stub structure designed thereon may include a second via pad disposed to be adjacent to the via hole, a short stub extending from the second via pad in a second direction perpendicular to the first direction, a transformer extending from the second via pad in a third direction different from the second direction so as to be connected to the at least one transmission line, and a second slot part configured to surround at least a portion of an edge of the second via pad, the short stub, and the transformer.
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公开(公告)号：US12183977B2
公开(公告)日：2024-12-31
申请号：US18361369
申请日：2023-07-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jungi Jeong , Chanju Park , Junhwa Oh , Sanghyuk Wi
Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub. The short stub structure designed on a second layer different from the first layer having the open stub structure designed thereon may include a second via pad disposed to be adjacent to the via hole, a short stub extending from the second via pad in a second direction perpendicular to the first direction, a transformer extending from the second via pad in a third direction different from the second direction so as to be connected to the at least one transmission line, and a second slot part configured to surround at least a portion of an edge of the second via pad, the short stub, and the transformer.
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公开(公告)号：US11626763B2
公开(公告)日：2023-04-11
申请号：US17262529
申请日：2019-09-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seunghyun Lee , Jaeseok Park , Chongmin Lee , Sungbum Park , Sanghyuk Wi , Youngho Ryu
Abstract: According to various embodiments, an electronic device comprises: a communication circuit for receiving a data communication signal including an interference signal by means of a power signal generated by a wireless power transmission device; and at least one processor, wherein the at least one processor can be configured to receive information related to the power signal from the wireless power transmission device through the communication circuit, estimate information about a channel with the wireless power transmission device, and use the communication circuit so as to remove, before decoding the data communication signal, the interference signal from the data communication signal on the basis of the information related to the power signal and the information about the channel Other various embodiments are possible.
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公开(公告)号：US11355970B2
公开(公告)日：2022-06-07
申请号：US16969091
申请日：2018-12-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaeseok Park , Sanghyuk Wi , Youngho Ryu , Sungbum Park , Sungku Yeo
Abstract: According to various embodiments, a wireless power transmission device comprises: a first-scheme communication circuit; a power source for generating a source signal; a power transmission circuit for forming an RF wave on the basis of the source signal; and a control circuit, wherein the control circuit can be configured to receive, from an electronic device supporting first-scheme communication and second-scheme communication, a communication signal including information on a communication environment according to the second-scheme communication through the first-scheme communication circuit, and to control, on the basis of the information on the communication environment according to the second-scheme communication, the frequency of the source signal generated by the power source and/or the transmission strength of the RF wave. Other various embodiments are possible.
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公开(公告)号：US11190053B2
公开(公告)日：2021-11-30
申请号：US16889214
申请日：2020-06-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinbong Lee , Beomwoo Gu , Jaehyun Park , Sanghyuk Wi
Abstract: A wireless power transmitter may include: a power factor correction (PFC) circuit configured to convert first alternating current (AC) power input from a power source into direct current (DC) power; an inverter configured to convert the DC power output from the PFC circuit into second AC power; a power transmission circuit configured to transmit wireless power, based on the second AC power output from the inverter; and at least one processor configured to identify at least one of a voltage or a current of the DC power output from the PFC circuit, and control an operation of the inverter based on the identified at least one of the voltage or the current.
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