公开(公告)号：US20230288676A1

公开(公告)日：2023-09-14

申请号：US18320506

申请日：2023-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin MOON ,  Sangung AN ,  Hosoon LEE ,  Jaehyun BAE ,  Kyunghoon LIM ,  Hyunsuk CHOI

IPC: G02B13/00 ,  G02B7/02 ,  H04M1/02

CPC classification number: G02B13/0055 ,  G02B7/021 ,  H04M1/026

Abstract: An example electronic device includes a window including a first surface and a second surface that faces the direction opposite to that of the first surface; a lens housing disposed in the internal space of the electronic device; and an optical lens module including a lens assembly aligned toward the second surface of the window in the lens housing, wherein the window includes: a window lens area formed on the first surface or the second surface; and an alignment guide formed on the perimeter of the window lens area for aligning the window lens area and the lens assembly.

公开(公告)号：US20230088012A1

公开(公告)日：2023-03-23

申请号：US17994135

申请日：2022-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hosoon LEE ,  Juree KIM ,  Sangung AN ,  Junseok KIM ,  Jongcheol JANG ,  Hyunsuk CHOI

IPC: H05K5/03 ,  B29C43/02 ,  B29C43/32

Abstract: A method of forming a transparent member according to an embodiment may include: a process of putting a first transparent substrate and a second transparent substrate into a first cavity of a lower mold that has a first depth and a second cavity of a lower mold that is connected to the first cavity and has a second depth, respectively; a process of disposing an upper mold, which corresponds to the lower mold and includes a pressing portion having at least one pressing surface, on an upper portion of the lower mold; a process of preheating at least one of the lower mold in which the transparent substrates are disposed or the upper mold to a predetermined temperature; and a process of thermoforming the preheated transparent substrates by pressing the preheated transparent substrates in a manner of pressing the upper mold. Various other embodiments identified through the specification are possible.