公开(公告)号：US20210028100A1

公开(公告)日：2021-01-28

申请号：US16863257

申请日：2020-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junso PAK ,  Seungki NAM ,  Jiyoung PARK ,  Bo PU

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A stack package may include a first substrate package, a second substrate package, an interposer and at least one semiconductor chip. The first substrate package may include a plurality of first pads isolated from direct contact with each other by a first pitch. The second substrate package may be under the first substrate package. The second substrate package may include a plurality of second pads isolated from direct contact with each other by a second pitch. The second pitch may be different from the first pitch. The interposer may be above the first substrate package. The interposer may include a plurality of third pads isolated from direct contact with each other by a third pitch. The semiconductor chip may be arranged above the interposer.