公开(公告)号：US20190124761A1

公开(公告)日：2019-04-25

申请号：US15966762

申请日：2018-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shle-Ge Lee ,  Youngbae Kim

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/498

Abstract: A printed circuit board can include a base layer, a first surface and a second surface opposite to each other. A first routing layer can be on the first surface and a second routing layer can be on the second surface, the first routing layer can be provided at an upper part of each of the first and second regions and the second routing layer can be provided at a lower part of each of the first and second regions. The upper part of the first region can have a first line-area ratio, the upper part of the second region can have a second line-area ratio, the lower part of the first region can have a third line-area ratio, the lower part of the second region can have a fourth line-area ratio, the second and third line-area ratios can be greater than each of the first and fourth line-area ratios.

公开(公告)号：US11776866B2

公开(公告)日：2023-10-03

申请号：US16994938

申请日：2020-08-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shle-Ge Lee ,  Youngbae Kim ,  Ae-Nee Jang

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/532 ,  H01L23/367 ,  H01L25/065

CPC classification number: H01L23/367 ,  H01L23/528 ,  H01L24/14 ,  H01L25/0655 ,  H01L2224/73253

Abstract: A semiconductor module includes a substrate having a central region, an outer region that surrounds the central region, and a middle region disposed between the central and the outer region, a first semiconductor package mounted on the central region of the substrate, a plurality of second semiconductor packages mounted on the middle region of the substrate, and a heat radiation structure disposed on the first semiconductor package and second semiconductor packages. The heat radiation structure includes a first part that is disposed on top surfaces of the first and second semiconductor packages, a second part that surrounds the middle region, a third part that is spaced apart from the second part and surrounds the first semiconductor package, and a fourth part that connects the second part to the third part.

公开(公告)号：US11527470B2

公开(公告)日：2022-12-13

申请号：US16872567

申请日：2020-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shle-Ge Lee ,  Youngbae Kim ,  Ji-Yong Park

IPC: H01L23/49 ,  H01L23/498 ,  H05K1/11 ,  H01L23/31 ,  H01L29/768

Abstract: Disclosed are film packages and methods of fabricating package modules. The film package includes a film substrate that includes a chip region and a peripheral region facing each other in a first direction, a plurality of output pads that are arranged in the first direction on the chip region and on the peripheral region, and a semiconductor chip on the chip region and electrically connected to the output pads. The output pads on the chip region are arranged at regular first intervals along the first direction. The output pads include a plurality of first output pads that are arranged at a first pitch along the first direction on the chip region and a plurality of second output pads on the peripheral region. The second output pads are arranged at a second pitch greater than the first pitch of the first output pads.

公开(公告)号：US11140772B2

公开(公告)日：2021-10-05

申请号：US16689403

申请日：2019-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shle-Ge Lee ,  Youngbae Kim

IPC: H05K1/02 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A printed circuit board can include a base layer, a first surface and a second surface opposite to each other. A first routing layer can be on the first surface and a second routing layer can be on the second surface, the first routing layer can be provided at an upper part of each of the first and second regions and the second routing layer can be provided at a lower part of each of the first and second regions. The upper part of the first region can have a first line-area ratio, the upper part of the second region can have a second line-area ratio, the lower part of the first region can have a third line-area ratio, the lower part of the second region can have a fourth line-area ratio, the second and third line-area ratios can be greater than each of the first and fourth line-area ratios.