公开(公告)号：US20210102841A1

公开(公告)日：2021-04-08

申请号：US17003197

申请日：2020-08-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoonseop KIM ,  Vladmir PROTOPOPOV ,  Minju KIM

IPC: G01J3/45 ,  H01L21/66

Abstract: A semiconductor substrate processing apparatus includes a transfer chamber disposed between process chambers performing processing of a semiconductor substrate, a transfer robot disposed inside the transfer chamber to load the semiconductor substrate into the process chamber and unload the semiconductor substrate whose processing has been performed in the process chamber, an optical assembly irradiates irradiation light having multiple wavelengths onto the semiconductor substrate, the optical assembly splitting measurement light reflected from a surface of the semiconductor substrate into first and second measurement light and collecting interference light caused by first reflected light and second reflected light, a light detector detecting the interference light and converting the interference light into an electric signal to produce an interference signal, and a controller extracting spectrum information for each wavelength of the measurement light from the interference signal and calculating distribution information of a film formed on the semiconductor substrate.