公开(公告)号：US20240261930A1

公开(公告)日：2024-08-08

申请号：US18536321

申请日：2023-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yejin Choi ,  Donghoon Kwon

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: A substrate polishing apparatus includes a platen having a surface configured polish through relative movement between the platen and a semiconductor substrate, a slurry supply configured to supply slurry to the platen, wherein the slurry flows to a location between the semiconductor substrate and the platen, a substrate holder configured to grip and fix the semiconductor substrate to be in contact with the platen such that the platen contacts the surface of the semiconductor substrate to be polished, a temperature controller having a thermal conductive body that is configured to contact the surface of the platen to transfer heat between the thermal conductive body and the platen to control the temperature of the platen, and a first cleaner having an ultrasonic transducer and at least one probe, the ultrasonic transducer configured to generate ultrasonic waves and the probe configured to transmit the ultrasonic waves to an outer surface of the thermal conductive body.