公开(公告)号：US20240356924A1

公开(公告)日：2024-10-24

申请号：US18758607

申请日：2024-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donghyun CHO ,  Yongje LEE ,  Yungyu GIM ,  Eunsang JANG ,  Seungjoo NA ,  Rakyoung YOON ,  Inchul HWANG

IPC: H04L9/40

CPC classification number: H04L63/10 ,  H04L63/062

Abstract: An apparatus and a method for operating a security device in an electronic device are provided. The electronic device includes an application processor, a communication processor, a security subsystem configured to process a security function, an authority assignment device configured to assign authority to access the security subsystem to the application processor or the communication processor, and a processor key management device configured to provide the security subsystem with a first key related to the application processor or a second key related to the communication processor assigned the authority to access the security subsystem from the authority assignment device, wherein the security subsystem is configured to process a security function related to the application processor or the communication processor by using the first key or the second key provided from the processor key management device, based on the authority assignment device assigning the authority to access the security subsystem to the application processor or the communication processor, and initialize data related to the application processor or the communication processor, based on returning the authority to access the security subsystem assigned to the application processor or the communication processor.

公开(公告)号：US20210358873A1

公开(公告)日：2021-11-18

申请号：US17199273

申请日：2021-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hosoo HAN ,  Yongje LEE

IPC: H01L23/00 ,  B23K20/00

Abstract: A wire bonding method includes bonding a tip of a wire provided through a clamp and a capillary onto a bonding pad of a chip, moving the capillary to a connection pad of a substrate corresponding to the bonding pad, bonding the wire to the connection pad to form a bonding wire connecting the bonding pad to the connection pad, before the capillary is raised from the connection pad, applying a electrical signal to the wire to detect whether the wire and the connection pad are in contact with each other, changing a state of the clamp to a closed state when the wire is not in contact with the connection pad and maintaining the state of the clamp in an open state when the wire is in contact with the connection pad, and raising the capillary from the connection pad while maintaining the state of the clamp.