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    Open-ended type substrate receiving cassette and system thereof
    1.
    发明授权
    Open-ended type substrate receiving cassette and system thereof 有权

    公开(公告)号：US11798829B2

    公开(公告)日：2023-10-24

    申请号：US17207182

    申请日：2021-03-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoon Su Kim

    IPC: H01L21/673 ,  B65G1/14

    CPC classification number: H01L21/67309 ,  B65G1/14 ,  H01L21/6732 ,  H01L21/67303

    Abstract: A cassette which receives a substrate, and a substrate receiving system including a chamber which receives a cassette in which a substrate is loaded are provided. The cassette which receives a substrate includes: a plurality of slot supports stacked in a first direction; and a frame connected to the plurality of slot supports and extending in the first direction, wherein the plurality of slot supports and the frame are opened in an outward direction to receive the substrate, and are closed in an inward direction after the substrate is received.

    Semiconductor Package
    2.
    发明申请
    Semiconductor Package 审中-公开

    公开(公告)号：US20200083184A1

    公开(公告)日：2020-03-12

    申请号：US16293239

    申请日：2019-03-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seung Min Baek ,  Yoon Su Kim ,  Seok Il Hong ,  Byung Lyul Park ,  Sung Han

    IPC: H01L23/00

    Abstract: A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

    Control device and method for controlling function thereof
    3.
    发明授权
    Control device and method for controlling function thereof 有权

    公开(公告)号：US10516741B2

    公开(公告)日：2019-12-24

    申请号：US15969078

    申请日：2018-05-02

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ye Seul Hong ,  Jae Seok Myung ,  Yoon Su Kim ,  Sahng Hee Bahn ,  Jung Joo Sohn ,  Kyung Ho Jeong ,  Young Kyu Jin

    IPC: H04L29/08 ,  G08C17/02 ,  H04W4/80 ,  H04L12/28 ,  H04B5/00

    Abstract: According to an embodiment, a smart control device includes an input device; a communication circuit; a connection circuit configured to be electrically connected to another control device; a processor; and a memory. Wherein the memory stores one or more instructions that, when executed, cause the processor to when the control device is not connected with the another control device through the connection circuit, transmit a message associated with a request for execution of a first function to the external device through the communication circuit when receiving an input signal based on the input device; and in when control device is connected with the another control device through the connection circuit, transmit a message associated with a request for execution of a second function corresponding to the second state to the external device through the communication circuit when receiving a user input associated with execution of a specified function.

    Semiconductor package
    6.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11380636B2

    公开(公告)日：2022-07-05

    申请号：US16293239

    申请日：2019-03-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seung Min Baek ,  Yoon Su Kim ,  Seok Il Hong ,  Byung Lyul Park ,  Sung Han

    IPC: H01L23/00

    Abstract: A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

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