公开(公告)号：US20250015064A1

公开(公告)日：2025-01-09

申请号：US18433777

申请日：2024-02-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon Young JEON ,  Young Min KIM ,  Ji Hyun LIM

IPC: H01L25/16 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H10B80/00

Abstract: A semiconductor device is described, in which a multi-bridge is packaged in a substrate to improve a small form factor. The semiconductor device comprises a substrate including a first surface and a second surface, which face each other, and defining a first cavity passing through the first surface and the second surface, a first redistribution layer structure formed on the first surface of the substrate, a second redistribution layer structure formed on the second surface of the substrate, a connection terminal disposed on the second redistribution layer structure, and a multi-bridge packaged in the first cavity, including a first bridge facing the first surface and electrically connected to the first redistribution layer structure and a second bridge facing the second surface and electrically connected to the second redistribution layer structure.