公开(公告)号：US20250015064A1

公开(公告)日：2025-01-09

申请号：US18433777

申请日：2024-02-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon Young JEON ,  Young Min KIM ,  Ji Hyun LIM

IPC: H01L25/16 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H10B80/00

Abstract: A semiconductor device is described, in which a multi-bridge is packaged in a substrate to improve a small form factor. The semiconductor device comprises a substrate including a first surface and a second surface, which face each other, and defining a first cavity passing through the first surface and the second surface, a first redistribution layer structure formed on the first surface of the substrate, a second redistribution layer structure formed on the second surface of the substrate, a connection terminal disposed on the second redistribution layer structure, and a multi-bridge packaged in the first cavity, including a first bridge facing the first surface and electrically connected to the first redistribution layer structure and a second bridge facing the second surface and electrically connected to the second redistribution layer structure.

公开(公告)号：US20160109096A1

公开(公告)日：2016-04-21

申请号：US14805444

申请日：2015-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Sam PARK ,  Hyun Bae PARK ,  Subedi RABINDRA ,  Chul Soo YOON ,  Giun LIM ,  Ji Hyun LIM ,  Young Sik JEONG ,  Hun Joo HAHM

IPC: F21V7/00 ,  F21V5/04 ,  F21V13/04 ,  F21V7/22 ,  F21V23/06 ,  F21K99/00 ,  F21V7/04

CPC classification number: G02B19/0047 ,  F21K9/23 ,  F21V29/763 ,  F21V29/77 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02B5/001 ,  H01L33/58 ,  H01L33/60

Abstract: A light emitting device package includes a reflective unit having a first surface and a second surface opposing the first surface and having a through hole formed in a central portion of the reflective unit to penetrate through the first and second surfaces, a light emitting device disposed in the through hole and externally exposed to one of the first and second surfaces, and an optical device disposed on the first surface of the reflective unit to cover the light emitting device. The optical device allows light generated by the light emitting device to be partially transmitted and partially reflected to be emitted externally.

Abstract translation: 发光器件封装包括反射单元，其具有第一表面和与第一表面相对的第二表面，并且具有形成在反射单元的中心部分中以穿透第一表面和第二表面的通孔，发光器件设置在 所述通孔从外部暴露于所述第一表面和第二表面之一，以及设置在所述反射单元的所述第一表面上以覆盖所述发光器件的光学器件。 光学装置允许由发光装置产生的光部分透射并部分反射以从外部发射。

公开(公告)号：US20160062033A1

公开(公告)日：2016-03-03

申请号：US14716701

申请日：2015-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Kyung KIM ,  Seog Ho LIM ,  Ji Hyun LIM

IPC: F21V8/00

CPC classification number: G02B6/0085 ,  G02B6/0053 ,  G02B6/0055 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/009 ,  G02B6/0091

Abstract: A light source module is provided. The light source module includes a substrate having a first surface on which a circuit portion is disposed, and a second surface disposed opposite thereto. The light source module further includes a plurality of light emitting devices mounted on the first surface of the substrate and electrically connected to the circuit portion, wherein the substrate is provided with a groove portion in the second surface thereof, and has a structure bent along the groove portion.

Abstract translation: 提供光源模块。 光源模块包括具有设置有电路部分的第一表面的基板和与其相对设置的第二表面。 光源模块还包括安装在基板的第一表面上并电连接到电路部分的多个发光器件，其中基板在其第二表面中设置有沟槽部分，并且具有沿着 槽部。