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1.
公开(公告)号:US11581182B2
公开(公告)日:2023-02-14
申请号:US17478619
申请日:2021-09-17
发明人: Seongkeun Cho , Young Hoo Kim , Seung Min Shin , Tae Min Earmme , Kun Tack Lee , Hun Jae Jang , Eun Hee Jeang
IPC分类号: H01L21/02 , B08B3/08 , H01L21/428 , H01L21/687
摘要: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.
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2.
公开(公告)号:US11862457B2
公开(公告)日:2024-01-02
申请号:US18098330
申请日:2023-01-18
发明人: SeongKeun Cho , Young Hoo Kim , Seung Min Shin , Tae Min Earmme , Kun Tack Lee , Hun Jae Jang , Eun Hee Jeang
IPC分类号: H01L21/02 , B08B3/08 , H01L21/428 , H01L21/687
CPC分类号: H01L21/02057 , B08B3/08 , H01L21/428 , H01L21/68764
摘要: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.
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