公开(公告)号：US20220276694A1

公开(公告)日：2022-09-01

申请号：US17643526

申请日：2021-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Younghun KIM ,  Kyungrae Kim ,  Min Sang Park ,  Junhyun Bae ,  Junchul Shin ,  Younghoon Lee

IPC: G06F1/3296 ,  G06F1/324

Abstract: A power management integrated circuit (PMIC) includes voltage regulators, a conversion circuit, a measurement cycle controller, an oscillator, and a control logic. The voltage regulators generate regulator voltages. The conversion circuit converts analog signals indicating load currents of the voltage regulators to generate digital signals corresponding to the load currents. The measurement cycle controller operates in response to a first clock signal having a first frequency and generates an oscillation enable signal that is activated during a measurement period. The oscillator generates a second clock signal having a second frequency higher than the first frequency in response to the oscillation enable signal. The control logic operates in response to the second clock signal and generates power information, indicating power consumed by the load currents during the measurement period, using the digital signals.

公开(公告)号：US20250105201A1

公开(公告)日：2025-03-27

申请号：US18741372

申请日：2024-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younghun KIM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package includes a package substrate including a package substrate comprising a base layer and a connection pad disposed on an upper surface of the base layer; a semiconductor chip disposed on the package substrate and the semiconductor chip comprises a semiconductor substrate and a bonding pad disposed on an upper surface of the semiconductor substrate; a bonding wire in contact with the connection pad and the bonding pad; a first dam structure disposed on the package substrate and arranged between the connection pad and the bonding pad; a non-conductive filler disposed on the package substrate surrounding the first dam structure and the bonding wire; and a mold layer disposed on the package substrate covering a portion of an upper surface of the package substrate and surrounding the semiconductor chip and the non-conductive filler.

公开(公告)号：US20240091902A1

公开(公告)日：2024-03-21

申请号：US18229026

申请日：2023-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangyun LEE ,  Younghun KIM

IPC: B24B37/32 ,  B24B57/02

CPC classification number: B24B37/32 ,  B24B57/02

Abstract: Provided is a retainer ring, a chemical mechanical polishing apparatuses including the same, and a substrate polishing method using the same. A slurry groove is upwardly recessed from a bottom surface of the retainer ring. The slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring. A curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove.

公开(公告)号：US20210248004A1

公开(公告)日：2021-08-12

申请号：US17168463

申请日：2021-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiljae KIM ,  Byungsoo KWON ,  Younghun KIM ,  Jaeho KIM ,  Hyunchul SEOK ,  Daehyun CHO ,  Wonseo CHOI

IPC: G06F9/48

Abstract: Disclosed is an electronic device including at least one processor, and a memory, operatively coupled to the at least one processor. The memory stores instructions configured to enable the at least one processor to identify, in response to running of an application, a plurality of tasks related to a running operation of the application, allocate virtual runtimes to the plurality of tasks when scheduling, adjust the virtual runtime of at least one task to be run with priority among the plurality of tasks to be a minimum value, arrange the at least one task with the adjusted virtual runtime, and run the at least one task with priority according to an arrangement order.

公开(公告)号：US20240248514A1

公开(公告)日：2024-07-25

申请号：US18625684

申请日：2024-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Giuk KANG ,  Younghun KIM ,  Dongmin SHIN ,  Jaehun KO

IPC: G06F1/16 ,  H05K5/02

CPC classification number: G06F1/1618 ,  G06F1/1652 ,  G06F1/1681 ,  H05K5/0226

Abstract: An electronic device is provided. The electronic device includes a housing including a first housing and a second housing configured to rotate with respect to the first housing, a display including a first display area disposed on the first housing and a second display area disposed on the second housing, a hinge module connected to the first housing and the second housing, and a hinge cover surrounding at least a portion of the hinge module, wherein the hinge module includes a hinge arm including a first hinge arm connected to the first housing and includes a first slot, and a second hinge arm connected to the second housing and includes a second slot, a shaft structure connected to the hinge cover, the shaft structure including a first shaft structure having at least a portion located within the first slot and providing a first shaft and a second shaft structure having at least a portion located within the second slot and providing a second shaft, and an interlocking structure including a first interlocking member connected to the first housing and including a first gear, and a second interlocking member connected to the second housing and including a second gear configured to rotate based on the rotation of the first gear, wherein the first hinge arm is configured to slide and rotate with respect to the first shaft based on a folding angle of the electronic device, and wherein the second hinge arm is configured to slide and rotate with respect to the second shaft based on the folding angle of the electronic device.

公开(公告)号：US20240121907A1

公开(公告)日：2024-04-11

申请号：US18544922

申请日：2023-12-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Giuk KANG ,  Dongmin SHIN ,  Jaehun KO ,  Younghun KIM ,  Hongsik PARK

IPC: H05K5/02 ,  G06F1/16

CPC classification number: H05K5/0226 ,  G06F1/1652 ,  G06F1/1681

Abstract: An electronic device according to various embodiments may include: a first housing; a second housing coupled to the first housing and configured to be slidable in a first direction; a flexible display having one end fixed to one of the first housing and the second housing, and including an information display area visible from the outside of the electronic device and configured to increase and/or decrease based on sliding of the second housing; and a hinge device including a hinge rotatably connecting the second housing to the first housing, wherein a rotation shaft of the hinge device may be inserted into an accommodation part extending in the first direction such that the rotation shaft is movable in the first direction in a process in which the second housing rotates relative to the first housing.