UPPER ELECTRODE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20230123891A1

    公开(公告)日:2023-04-20

    申请号:US18085949

    申请日:2022-12-21

    Abstract: An upper electrode used for a substrate processing apparatus using plasma is provided. The upper electrode includes a bottom surface including a center region and an edge region having a ring shape and surrounding the center region, a first protrusion portion protruding toward plasma from the edge region and having a ring shape, wherein the first protrusion portion includes a first apex corresponding to a radial local maximum point toward the plasma, and a first distance, which is a radial-direction distance between the first apex and a center axis of the upper electrode, is greater than a radius of a substrate.

    METHOD AND APPARATUS WITH SUPER RESOLUTION
    4.
    发明公开

    公开(公告)号:US20240153035A1

    公开(公告)日:2024-05-09

    申请号:US18330654

    申请日:2023-06-07

    CPC classification number: G06T3/4076 G06T3/4046

    Abstract: A processor-implemented method includes generating an adjusted reference patch by adjusting a position of a reference patch in a reference image based on a pixel value of a ground truth (GT) patch of a GT image and a pixel value of the reference patch, wherein the GT patch corresponds to a specific region of an input image; generating a super-resolution (SR) image of the input image using a SR model provided an input that is based on the generated adjusted reference patch; and training the SR model based on the SR image and the GT image.

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