公开(公告)号：US20230123891A1

公开(公告)日：2023-04-20

申请号：US18085949

申请日：2022-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungjo KIM ,  Sangki NAM ,  Jungmin KO ,  Kwonsang SEO ,  Seungbo SHIM ,  Younghyun JO

IPC: H01J37/32

Abstract: An upper electrode used for a substrate processing apparatus using plasma is provided. The upper electrode includes a bottom surface including a center region and an edge region having a ring shape and surrounding the center region, a first protrusion portion protruding toward plasma from the edge region and having a ring shape, wherein the first protrusion portion includes a first apex corresponding to a radial local maximum point toward the plasma, and a first distance, which is a radial-direction distance between the first apex and a center axis of the upper electrode, is greater than a radius of a substrate.

公开(公告)号：US20240192604A1

公开(公告)日：2024-06-13

申请号：US18216028

申请日：2023-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehong LIM ,  Youngho HWANG ,  Byungjo KIM ,  Sangki NAM ,  Suyoung YOO ,  Sanghyun LIM ,  Youngkyun IM ,  Hyungkyu CHOI ,  Seok HEO

IPC: G03F7/40

CPC classification number: G03F7/40

Abstract: A post baking apparatus comprising a baking chamber configured to receive a substrate with an exposed photoresist film, a lower heater in the baking chamber under the substrate to heat the exposed photoresist film, an applier applying an electric field or a magnetic field to the exposed photoresist film along a vertical direction, which is substantially perpendicular to an upper surface of the exposed photoresist film, to control diffusions of an acid or a secondary electron, which are generated from the exposed photoresist film, along a horizontal direction, and a controller configured to control an operation of the applier.

公开(公告)号：US20210098415A1

公开(公告)日：2021-04-01

申请号：US16837025

申请日：2020-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Byungjo KIM ,  Sanghoon LEE ,  Sukwon LEE ,  Sebin CHOI

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

公开(公告)号：US20230238351A1

公开(公告)日：2023-07-27

申请号：US18128449

申请日：2023-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Byungjo KIM ,  Sanghoon LEE ,  Sukwon LEE ,  Sebin CHOI

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

CPC classification number: H01L24/75 ,  B29C65/30 ,  B29C66/8185 ,  H01L2224/75502 ,  H01L2224/75745 ,  H01L2224/75252 ,  H01L2224/75984

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.