公开(公告)号：US20200052428A1

公开(公告)日：2020-02-13

申请号：US16511331

申请日：2019-07-15

Applicant: Samsung Electronics Co., Ltd. ,  Hyupjinconnector Co., Ltd.

Inventor： Yonglak CHO ,  Jeongki PARK ,  Mihyun KIM ,  Jeongyong LEE ,  Choonggeun LEE ,  Dongjin CHUNG ,  Jangwon HUR ,  Jiwoo LEE

IPC: H01R13/24 ,  H05K1/18 ,  H01Q5/307 ,  H01Q1/24

Abstract: The disclosure includes a housing including a first plate, a second plate, and a side member surrounding a space between the first and second plates, a printed circuit board disposed in the space and including an opening, a first conductive structure disposed in the space, a second conductive structure disposed in the space, and a flexible conductive member located between the first and second conductive structures through the opening to construct an electrical path between the first and second conductive structures. The flexible conductive member may include a base, a first flexible portion having a first height from the base, protruding from the base toward the first plate, and in contact with the first conductive structure, and a second flexible portion having a second height from the base, protruding from the base toward the second plate, and in contact with the second conductive structure.