公开(公告)号：US11247285B1

公开(公告)日：2022-02-15

申请号：US16839307

申请日：2020-04-03

Applicant: Seagate Technology LLC

Inventor： Aaron Collins ,  Joseph Nelson

IPC: B23K3/00 ,  B23K3/06 ,  B05C11/10 ,  B65G47/20

Abstract: An apparatus includes a hopper configured to receive a plurality of solder microspheres, and a moveable singulation device positioned proximate to and below the hopper. The moveable singulation device is configured to receive the plurality of solder microspheres from the hopper as the plurality of microspheres exit the hopper. The movable singulation device includes a plurality of holes, with each of the plurality of holes configured to receive a single solder microsphere of the plurality of solder micro spheres. The apparatus further includes a piezoelectric vibration device configured to provide ultrasonic vibrations to the singulation device, thereby preventing agglomeration of the plurality of solder microspheres in the hopper.