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公开(公告)号：US10556284B2
公开(公告)日：2020-02-11
申请号：US14833549
申请日：2015-08-24
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Paul Davidson , Ralph Smith
Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
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公开(公告)号：US11541471B2
公开(公告)日：2023-01-03
申请号：US16776966
申请日：2020-01-30
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Paul Davidson , Ralph Smith
Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
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Patent Agency Ranking
公开(公告)号：US11247285B1
公开(公告)日：2022-02-15
申请号：US16839307
申请日：2020-04-03
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Joseph Nelson
Abstract: An apparatus includes a hopper configured to receive a plurality of solder microspheres, and a moveable singulation device positioned proximate to and below the hopper. The moveable singulation device is configured to receive the plurality of solder microspheres from the hopper as the plurality of microspheres exit the hopper. The movable singulation device includes a plurality of holes, with each of the plurality of holes configured to receive a single solder microsphere of the plurality of solder micro spheres. The apparatus further includes a piezoelectric vibration device configured to provide ultrasonic vibrations to the singulation device, thereby preventing agglomeration of the plurality of solder microspheres in the hopper.
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公开(公告)号：US20200164453A1
公开(公告)日：2020-05-28
申请号：US16776966
申请日：2020-01-30
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Paul Davidson , Ralph Smith
Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
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公开(公告)号：US20200098388A1
公开(公告)日：2020-03-26
申请号：US16139590
申请日：2018-09-24
Applicant: Seagate Technology LLC
Inventor： Paul Davidson , Scott Damon Matzke , Christopher Unger , Aaron Collins
IPC: G11B5/48
Abstract: An apparatus includes a slider which includes a slider body with a leading edge and a trailing edge and a plurality of slider bond pads disposed at the trailing edge. The slider bond pads are configured to align opposite to suspension trace bond pads on a suspension to form a solderable gap between the slider bond pads and the suspension trace bond pads.
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公开(公告)号：US10600436B1
公开(公告)日：2020-03-24
申请号：US16239641
申请日：2019-01-04
Applicant: Seagate Technology LLC
Inventor： Paul Davidson , Aaron Collins , Scott D. Matzke
Abstract: An apparatus includes a slider body with a first portion formed of a first insulating material and a second portion formed of a second insulating material that is different from the first insulating material. The second portion of the slider body is at a trailing edge of the slider body and the second portion includes a bearing surface and a top surface opposite the bearing surface. A plurality of bond pads are disposed on the top surface of the second portion such that an entire bottom surface of each of the plurality bond pads is attached to the top surface of the second portion.
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7.发明申请公开(公告)号：US20170056995A1
公开(公告)日：2017-03-02
申请号：US14833549
申请日：2015-08-24
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Paul Davidson , Ralph Smith
CPC classification number: B23K1/0056 , B23K1/0016 , B23K3/0623
Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere until it falls from the exit orifice toward the connection area between the first and second components, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
Abstract translation: 一种用于将头部万向节组件的多个部件与焊接接头相互连接的方法，包括以下步骤：将第一部件邻近第二部件定位，以提供第一和第二部件之间的连接区域，将焊球分配到毛细管 包括锥形壁，其中毛细管定位成在第一和第二部件之间的连接区域上方具有出口孔，对毛细管加压直到达到预定压力，向焊球施加第一激光脉冲以提供一定程度的 热能使焊球液化，直到其从出口孔落到第一和第二部件之间的连接区域为止，检测液化焊球离开毛细管的出口后的运动，并施加第二激光 脉冲以回流焊球以在第一和第二部件之间形成焊接接头。
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