公开(公告)号：US09321143B2

公开(公告)日：2016-04-26

申请号：US14048326

申请日：2013-10-08

Applicant: Seagate Technology LLC

Inventor： Marc Perry Ronshaugen ,  Gordon Merle Jones ,  Robert Edward Chapin

IPC: B24B37/34 ,  B24B37/30 ,  B24B49/00

CPC classification number: B24B37/345 ,  B24B37/30 ,  B24B49/00

Abstract: A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.

Abstract translation: 公开了一种用于包括研磨控制特征的研磨组件的头部结构。 研磨控制特征包括从研磨组件的头部结构的前表面升高的凸起的接触表面。 对准工件和凸起接触表面的相对位置，以控制工件厚度和其他研磨参数。 在所示实施例中，工件和凸起接触表面的相对位置经由头部结构上的调节机构对准。 在所示实施例中，调节机构构造成调节工件相对于凸起接触表面的位置。

公开(公告)号：US20150099426A1

公开(公告)日：2015-04-09

申请号：US14048326

申请日：2013-10-08

Applicant: Seagate Technology LLC

Inventor： Marc Perry Ronshaugen ,  Gordon Merle Jones ,  Robert Edward Chapin

IPC: B24B37/34 ,  B24B49/00 ,  B24B37/30

CPC classification number: B24B37/345 ,  B24B37/30 ,  B24B49/00

Abstract: A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.

Abstract translation: 公开了一种用于包括研磨控制特征的研磨组件的头部结构。 研磨控制特征包括从研磨组件的头部结构的前表面升高的凸起的接触表面。 对准工件和凸起接触表面的相对位置，以控制工件厚度和其他研磨参数。 在所示实施例中，工件和凸起接触表面的相对位置经由头部结构上的调节机构对准。 在所示实施例中，调节机构构造成调节工件相对于凸起接触表面的位置。