公开(公告)号：US20230352326A1

公开(公告)日：2023-11-02

申请号：US18349666

申请日：2023-07-10

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC分类号： H01L21/67 ,  B24B37/10 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34 ,  H01L21/304 ,  H01L21/306 ,  H01L21/02

CPC分类号： H01L21/67248 ,  H01L21/67178 ,  H01L21/67109 ,  H01L21/67051 ,  H01L21/67046 ,  H01L21/67028 ,  H01L21/67219 ,  B24B37/105 ,  B24B49/14 ,  B24B53/017 ,  B24B37/345 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/6704 ,  H01L21/02065 ,  H01L21/02052

摘要： A polishing apparatus is provided. The polishing apparatus includes:



a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

公开(公告)号：US20170323814A1

公开(公告)日：2017-11-09

申请号：US15527454

申请日：2015-07-22

申请人： LG SILTRON INCORPORATED

发明人： Jae Hyun BAE

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683

CPC分类号： H01L21/67259 ,  B24B37/08 ,  B24B37/345 ,  B24B49/12 ,  H01L21/67219 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/681 ,  H01L21/6838

摘要： An embodiment relates to a wafer loading apparatus of wafer polishing equipment. Provided is the wafer loading apparatus of wafer polishing equipment, comprising: a wafer polisher that includes a polishing carrier having a wafer hole formed therein in which a wafer is loaded, wherein both sides of the wafer are polished by top and bottom boards; a wafer transferrer that includes a transfer arm disposed above the polishing carrier to transfer the wafer, wherein a transfer plate corresponding to a shape of the wafer is connected to one end the transfer arm; a wafer position detector mounted on a bottom surface of the transfer plate to detect a position of the wafer hole; a plurality of wafer attachment/detachment units formed on an edge portion of the transfer plate; a wafer aligner mounted on a top surface of the transfer plate to align the wafer; and a controller to which data on the position of the wafer hole, which is detected by the wafer position detector, is transmitted and which calculates a position where the wafer is to be loaded by the wafer attachment/detachment unit and the wafer aligner.

公开(公告)号：US20170252894A1

公开(公告)日：2017-09-07

申请号：US15601575

申请日：2017-05-22

申请人： EBARA CORPORATION

发明人： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC分类号： B24B37/34 ,  H01L21/677 ,  H01L21/306 ,  H01L21/67

CPC分类号： B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US09744641B2

公开(公告)日：2017-08-29

申请号：US14804513

申请日：2015-07-21

申请人： LG SILTRON INCORPORATED

发明人： Kee Yun Han

IPC分类号： B24B37/00 ,  B24B41/00 ,  B24B37/28 ,  B24B37/08 ,  B24B37/02 ,  B24B37/34 ,  B24B37/005 ,  B24B7/17

CPC分类号： B24B41/005 ,  B24B7/17 ,  B24B37/005 ,  B24B37/022 ,  B24B37/08 ,  B24B37/28 ,  B24B37/345

摘要： A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.

公开(公告)号：US09610673B2

公开(公告)日：2017-04-04

申请号：US14160928

申请日：2014-01-22

申请人： EBARA CORPORATION

发明人： Tsuneo Torikoshi

IPC分类号： B24B49/18 ,  B24B53/017 ,  B24B53/007 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/34 ,  B24B27/00

CPC分类号： B24B37/042 ,  B24B27/0023 ,  B24B37/005 ,  B24B37/013 ,  B24B37/345 ,  B24B49/18 ,  B24B53/007 ,  B24B53/017

摘要： A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

公开(公告)号：US20170069523A1

公开(公告)日：2017-03-09

申请号：US15122524

申请日：2015-02-17

申请人： SHIN-ETSU HANDOTAI CO., LTD.

发明人： Taichi YASUDA ,  Tatsuo ENOMOTO

IPC分类号： H01L21/683 ,  B25J15/06

CPC分类号： H01L21/6838 ,  B24B37/345 ,  B24B41/06 ,  B25J15/0658 ,  B25J15/0666 ,  B25J15/0683 ,  H01L21/304

摘要： A workpiece holding apparatus, including: a rigid body having a vent; a suction pad adhered onto the lower end face of rigid body and having an opening communicating with vent, being configured to suck and hold a workpiece; an air controlling mechanism communicating with the vent, being configured to aspirate or discharge air through vent to aspirate or discharge air from opening; and a swelling portion being configured to be supplied with air by air controlling mechanism through the vent to swell out at least part of an area of suction pad to be in contact with the workpiece toward the workpiece in detaching workpiece from suction pad; wherein suction pad is configured to suck and hold workpiece by bringing the opening into contact with workpiece while aspirating air by air controlling mechanism through opening, and is configured to detach the workpiece from suction pad by discharging air from opening.

摘要翻译： 一种工件保持装置，包括：具有通风口的刚体; 吸附垫粘附到刚体的下端面上，并且具有与排气口连通的开口，被构造成吸附和保持工件; 与排气口连通的空气控制机构，其构造成通过排气口吸入或排出空气，以从开口抽吸或排出空气; 以及膨胀部，其通过所述排气口由空气控制机构供给空气，以使从所述工件脱离吸附垫而将与所述工件接触的吸附区域的至少一部分区域向所述工件膨胀; 其特征在于，所述吸盘构成为通过使所述开口与工件接触而吸引和保持工件，同时通过打开通过空气控制机构吸入空气，并且通过从开口排出空气来将工件从吸盘上分离。

公开(公告)号：US09390903B2

公开(公告)日：2016-07-12

申请号：US14022107

申请日：2013-09-09

申请人： AXUS TECHNOLOGY, LLC

发明人： Daniel R. Trojan ,  Richard Ciszek ,  Clifford Daniel

IPC分类号： H01L21/02 ,  B24B27/00 ,  B24B37/10 ,  B24B37/34 ,  B24B9/06

CPC分类号： H01L21/02008 ,  B24B9/065 ,  B24B27/0023 ,  B24B27/0069 ,  B24B37/107 ,  B24B37/345 ,  H01L21/02021

摘要： A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes. The apparatus includes one or more grind spindles that overlay the turntable and are configured to communicate with the workpieces. The apparatus processes the workpieces by transitioning between first and second operational states. The first operational state centers the spindles and the workpieces thereon under the grind spindle to condition an entire top surface of the workpieces. The second operational state offsets the spindles from the center of the grind spindle to condition a perimeter edge of the workpieces. A controller can govern the transition between first and second operational states.

摘要翻译： 提供了一种工件处理装置。 该设备包括在其上具有一个或多个主轴的旋转转台，该转台被配置为围绕转台轴线旋转。 每个主轴构造成在其上接收和固定待由该装置处理的工件。 每个主轴都可以围绕自己的独立轴旋转。 该设备包括一个或多个重心轴，该主轴重叠在转台上并被构造成与工件通信。 该装置通过在第一和第二操作状态之间转换来处理工件。 第一操作状态将主轴和工件放置在研磨主轴下方以调节工件的整个顶表面。 第二操作状态将主轴从研磨主轴的中心偏移以调节工件的周边边缘。 控制器可以控制第一和第二操作状态之间的转换。

公开(公告)号：US09355882B2

公开(公告)日：2016-05-31

申请号：US14096217

申请日：2013-12-04

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ming-Tung Wu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

IPC分类号： H01L21/683 ,  B24B37/34 ,  H01L21/687 ,  B24B37/30 ,  B24B41/00 ,  H01L21/67

CPC分类号： H01L21/6838 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  H01L21/67288 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/68771

摘要： A wafer grinding system includes a robot arm having a suction board at one end and a table within reach of the robot arm. An upper surface of the table has a vacuum surface for sucking and holding wafers. A pusher coupled to the robot arm extends about the periphery of the suction board. The pusher flattens wafers against the upper surface of the table, allowing the table to hold by suction wafers that would otherwise be too bowed to be held in that way. Additionally, a table can have a vacuum area that is small in comparison to the wafers, which is another way of increasing the magnitude of wafer bow that can be tolerated. A grinding system can use the reduced vacuum area concept to allow the positioning table to hold bowed wafers and the pusher concept to allow the chuck tables to hold bowed wafers.

摘要翻译： 晶片研磨系统包括机器人臂，其在一端具有吸引板，在机器人手臂的范围内具有桌子。 桌子的上表面具有用于吸取和保持晶片的真空表面。 联接到机器人臂的推动器围绕吸板的周边延伸。 推动器使晶片抵靠桌子的上表面平坦化，从而允许桌子由吸着的晶片保持，否则将被太鞠躬不能以这种方式保持。 此外，桌子可以具有与晶片相比较小的真空区域，这是增加可以容忍的晶片弓的大小的另一种方式。 研磨系统可以使用减小的真空区域概念来允许定位台保持弓形晶片和推动器概念，以允许卡盘台保持弯曲的晶片。

公开(公告)号：US09352441B2

公开(公告)日：2016-05-31

申请号：US14510195

申请日：2014-10-09

申请人： Applied Materials, Inc.

发明人： Steven M. Zuniga ,  Chih Hung Chen ,  Jay Gurusamy

IPC分类号： B24B37/10 ,  B24B37/34

CPC分类号： B24B37/10 ,  B24B37/345

摘要： A chemical mechanical polishing system is provided. The chemical mechanical polishing system includes a platen, a load cup, a hub, a first polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup, and a second polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup the second arm rotatable independently from the hub.

摘要翻译： 提供化学机械抛光系统。 所述化学机械抛光系统包括压板，负载杯，轮毂，从所述轮毂悬臂并能围绕所述压板和所述负载杯之间的所述轮毂的中心线旋转的第一抛光臂，以及从所述轮毂悬臂的第二抛光臂， 围绕压板和负载杯之间的毂的中心线，第二臂可独立于轮毂旋转。

公开(公告)号：US09283690B2

公开(公告)日：2016-03-15

申请号：US13058397

申请日：2009-06-03

申请人： Kazuaki Bando

发明人： Kazuaki Bando

IPC分类号： B24B9/10 ,  H01L21/677 ,  C03B33/03 ,  B65G47/91 ,  B65G49/06 ,  B26F3/00 ,  B24B37/34

CPC分类号： B26F3/00 ,  B24B37/345 ,  B65G49/064 ,  B65G49/066 ,  B65G2249/04 ,  C03B33/03 ,  H01L21/677 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T225/12 ,  Y10T225/307 ,  Y10T225/321

摘要： A glass-plate working apparatus includes a glass-plate supporting portion 20a of a feed conveyor 7, a glass-plate supporting portion 20b of a cutting section 2, a glass-plate supporting portion 20c of a bend-breaking section 4, a glass-plate supporting portion 20d of a grinding section 3, and a glass-plate supporting portion 20e of a discharge conveyor 8; a cutting head 9, a bend-breaking device 66, and a grinding head 10 for processing glass plates 5 which are respectively supported by the supporting portions 20b, 20c, and 20d; and a transporting device 89 for transporting the glass plate 5 on the supporting portion 20a onto the supporting portion 20b, the glass plate 5 on the supporting portion 20b onto the supporting portion 20c, the glass plate 5 on the supporting portion 20c onto the supporting portion 20d, and the glass plate 5 on the supporting portion 20d onto the supporting portion 20e, respectively. The transporting device 89 is adapted to repeat reciprocating movement so as to sequentially transfer the glass plate 5 onto each of the supporting portions 20a, 20b, 20c, 20d, and 20e each time the processing operation by processing means is completed.

摘要翻译： 玻璃板加工装置包括进料输送机7的玻璃板支撑部分20a，切割部分2的玻璃板支撑部分20b，折弯部分4的玻璃板支撑部分20c，玻璃板 研磨部3的板支撑部20d和排出输送机8的玻璃板支撑部20e; 切割头9，折弯装置66和用于加工玻璃板5的研磨头10，它们分别由支撑部分20b，20c和20d支撑; 以及用于将支撑部分20a上的玻璃板5输送到支撑部分20b上的运送装置89，支撑部分20b上的玻璃板5支撑在支撑部分20c上，将支撑部分20c上的玻璃板5支撑到支撑部分 20d和支撑部分20d上的玻璃板5分别支撑在支撑部分20e上。 传送装置89适于重复往复运动，以便每当处理装置的处理操作完成时，将玻璃板5依次传送到每个支撑部分20a，20b，20c，20d和20e上。