公开(公告)号：US20140368230A1

公开(公告)日：2014-12-18

申请号：US14471801

申请日：2014-08-28

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Takuya TSURUME ,  Etsuko ASANO

IPC: G01R31/26

CPC classification number: G01R31/2601 ,  G01R31/2607 ,  G01R31/2822 ,  G01R31/2884 ,  H01L21/6835 ,  H01L21/78 ,  H01L22/14 ,  H01L22/34 ,  H01L23/66 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. According to a measuring method of a semiconductor device in which an element layer provided with a test element including a terminal portion is sealed with first and second films having flexibility, the first film formed over the terminal portion is removed to form a contact hole reaching the terminal portion; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed.

Abstract translation: 提供能够容易进行物理测试而不劣化特性的半导体器件。 根据半导体器件的测量方法，其中设置有包括端子部分的测试元件的元件层被具有柔性的第一和第二膜密封，去除在端子部分上形成的第一膜以形成到达 端子部分 接触孔填充含有导电材料的树脂; 在将具有柔性的布线基板布置在已经进行了填充的树脂上之后进行加热，使得具有柔性的端子部分和布线基板通过包含导电材料的树脂电连接; 并进行测量。