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公开(公告)号：US10928588B2
公开(公告)日：2021-02-23
申请号：US16160706
申请日：2018-10-15
Applicant: Skorpios Technologies, Inc.
Inventor： Majid Sodagar , Stephen B. Krasulick , John Zyskind , Paveen Apiratikul , Luca Cafiero
Abstract: A device for optical communication is described. The device comprises two transceivers integrated on one chip. A first transceiver can be used with existing optical-communication architecture. As a more advanced optical-communication architecture becomes adopted, the device can be switched from using the first transceiver to using a second transceiver to communicate using the more advanced optical-communication architecture.
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公开(公告)号：US11624872B2
公开(公告)日：2023-04-11
申请号：US17539474
申请日：2021-12-01
Applicant: Skorpios Technologies, Inc.
Inventor： Paveen Apiratikul , Damien Lambert
Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.
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公开(公告)号：US11194092B2
公开(公告)日：2021-12-07
申请号：US16690483
申请日：2019-11-21
Applicant: Skorpios Technologies, Inc.
Inventor： Paveen Apiratikul , Damien Lambert
Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.
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公开(公告)号：US20230358951A1
公开(公告)日：2023-11-09
申请号：US18179167
申请日：2023-03-06
Applicant: Skorpios Technologies, Inc.
Inventor： Paveen Apiratikul , Damien Lambert
CPC classification number: G02B6/12004 , G02B6/122 , G02B6/136 , G02B2006/12061 , G02B2006/12121 , G02B2006/12128 , G02B6/1225
Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.
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公开(公告)号：US20190113680A1
公开(公告)日：2019-04-18
申请号：US16160706
申请日：2018-10-15
Applicant: Skorpios Technologies, Inc.
Inventor： Majid Sodagar , Stephen B. Krasulick , John Zyskind , Paveen Apiratikul , Luca Cafiero
Abstract: A device for optical communication is described. The device comprises two transceivers integrated on one chip. A first transceiver can be used with existing optical-communication architecture. As a more advanced optical-communication architecture becomes adopted, the device can be switched from using the first transceiver to using a second transceiver to communicate using the more advanced optical-communication architecture.
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Patent Agency Ranking
公开(公告)号：US11360263B2
公开(公告)日：2022-06-14
申请号：US16777727
申请日：2020-01-30
Applicant: Skorpios Technologies, Inc.
Inventor： Majid Sodagar , Paveen Apiratikul
Abstract: An optical device comprises a substrate, a waveguide disposed on the substrate, and a spot size converter (SSC) disposed on the substrate. The waveguide comprises a shoulder and a ridge. The SSC comprises a shoulder and a ridge. The ridge of the waveguide is aligned to a first stage of the ridge of the SSC. The waveguide is made of a first material. The shoulder and the ridge of the SSC are made of a second material. The second material is different from the first material.
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公开(公告)号：US11079549B2
公开(公告)日：2021-08-03
申请号：US16839826
申请日：2020-04-03
Applicant: Skorpios Technologies, Inc.
Inventor： Majid Sodagar , Stephen B. Krasulick , John Zyskind , Paveen Apiratikul , Luca Cafiero
Abstract: A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.
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公开(公告)号：US10649148B2
公开(公告)日：2020-05-12
申请号：US16171132
申请日：2018-10-25
Applicant: Skorpios Technologies, Inc.
Inventor： Majid Sodagar , Stephen B. Krasulick , John Zyskind , Paveen Apiratikul , Luca Cafiero
Abstract: A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.
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公开(公告)号：US20220196911A1
公开(公告)日：2022-06-23
申请号：US17539474
申请日：2021-12-01
Applicant: Skorpios Technologies, Inc.
Inventor： Paveen Apiratikul , Damien Lambert
Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.
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公开(公告)号：US20200301072A1
公开(公告)日：2020-09-24
申请号：US16777727
申请日：2020-01-30
Applicant: Skorpios Technologies, Inc.
Inventor： Majid Sodagar , Paveen Apiratikul
Abstract: A method is provided for forming an optical device having a waveguide and a spot size converter (SSC). The method includes providing a crystalline semiconductor region and a non-crystalline semiconductor region on a substrate. The crystalline semiconductor region is coupled to the non-crystalline semiconductor region. The method also includes simultaneously etching the non-crystalline semiconductor region and the crystalline semiconductor region using a same etch mask to form a spot size converter coupled a waveguide. The waveguide has a ridge over a shoulder, and the spot size converter has a ridge over a shoulder.
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