公开(公告)号：US06547974B1

公开(公告)日：2003-04-15

申请号：US08495277

申请日：1995-06-27

申请人： Stanley Michael Albrechta ,  Christina Marie Boyko ,  Kathleen Lorraine Covert ,  Natalie Barbara Feilchenfeld ,  Voya Rista Markovich ,  William Earl Wilson ,  Michael Wozniak

发明人： Stanley Michael Albrechta ,  Christina Marie Boyko ,  Kathleen Lorraine Covert ,  Natalie Barbara Feilchenfeld ,  Voya Rista Markovich ,  William Earl Wilson ,  Michael Wozniak

IPC分类号： H01B1300

CPC分类号： H05K3/22 ,  H05K3/06 ,  H05K3/062 ,  H05K3/108 ,  H05K2203/025 ,  H05K2203/0346 ,  H05K2203/0353 ,  H05K2203/0392 ,  H05K2203/1476

摘要： A printed circuit board is produced by patterning a resist layer according to a circuit mask that defines desired circuit paths. The resist pattern layer is formed by removing the resist from the board in the desired circuit paths and a conductive material is plated onto the board in the resist voids defined by the circuit mask so that the height of the conductive material relative to the substrate equals or exceeds the height of the resist layer relative to the substrate. A low-reactive solution is applied over the conductive material and removes a surface portion of the conductive material. As the solution removes the conductive layer, it forms a film barrier and the solution composition changes, both of which substantially inhibits any further removal of the conductive material. Next, the film barrier is removed from the board allowing another film barrier to form stimulating the removal of further conductive material. The removal step is repeated until the conductive material is at a desired height relative to the height of the resist layer. The board is then finished using conventional circuit board fabrication techniques.

摘要翻译： 通过根据限定所需电路路径的电路掩模图案化抗蚀剂层来制造印刷电路板。 抗蚀剂图案层通过在所需的电路路径中从基板上去除抗蚀剂而形成，并且导电材料被电镀在由电路掩模限定的抗蚀剂空隙中的基板上，使得导电材料相对于基板的高度等于或等于 超过抗蚀剂层相对于基底的高度。 将低反应性溶液施加在导电材料上并除去导电材料的表面部分。 当溶液去除导电层时，其形成膜阻挡层并且溶液组成发生变化，这两者基本上禁止任何进一步去除导电材料。 接下来，从板上去除膜屏障，允许另一个膜屏障形成刺激去除另外的导电材料。 重复去除步骤，直到导电材料相对于抗蚀剂层的高度处于期望的高度。 然后使用常规电路板制造技术完成电路板。