公开(公告)号：US20170064838A1

公开(公告)日：2017-03-02

申请号：US15250595

申请日：2016-08-29

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Paul S.C. Wu ,  Chun-Ting Lai ,  Yen-Po Huang ,  Sheng-Yu Huang

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/007 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2203/0264

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

Abstract translation: 根据一些实施例，本公开涉及柔性电路板的制造，其包括形成包含聚酰亚胺的基层，在基层上形成聚酰亚胺层，所述聚酰亚胺层具有第一表面和与第二表面相对的第二表面 彼此之间，第一表面可剥离地与基底层接触，在聚酰亚胺层的第二表面上形成金属层，并且在聚酰亚胺层上剥离基底层，金属层残留在聚酰亚胺的第二表面上 层。