公开(公告)号：US10334738B2

公开(公告)日：2019-06-25

申请号：US15365664

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H01L21/683 ,  H01L23/498 ,  C03C17/34 ,  C08L79/08 ,  C08G73/10 ,  C09D179/08

Abstract: A method of fabricating a flexible substrate assembly includes forming a first polyimide layer on a rigid support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution, an adhesion promoting agent and a release agent for achieving different adhesion strength at two opposite sides of the first polyimide layer, and forming a flexible second polyimide layer on the first polyimide layer, the second polyimide layer being adhered in contact with the first polyimide layer, and a peeling strength between the first and second polyimide layers being less than a peeling strength between the first polyimide layer and the support base so that the second polyimide layer is peelable from the first polyimide layer while the first polyimide layer remains adhered in contact with the support base.

公开(公告)号：US20180042125A1

公开(公告)日：2018-02-08

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/46 ,  C08L79/08 ,  H05K1/03

CPC classification number: H05K3/007 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

公开(公告)号：US09839136B2

公开(公告)日：2017-12-05

申请号：US15250595

申请日：2016-08-29

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Paul S. C. Wu ,  Chun-Ting Lai ,  Yen-Po Huang ,  Sheng-Yu Huang

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/28

CPC classification number: H05K3/007 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2203/0264

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

公开(公告)号：US20180042116A1

公开(公告)日：2018-02-08

申请号：US15365664

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/00 ,  C03C17/34 ,  H01L23/498 ,  H05K1/03 ,  H01L21/683

CPC classification number: H05K3/007 ,  C03C17/30 ,  C03C17/32 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C03C2218/355 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible substrate assembly includes forming a first polyimide layer on a rigid support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution, an adhesion promoting agent and a release agent for achieving different adhesion strength at two opposite sides of the first polyimide layer, and forming a flexible second polyimide layer on the first polyimide layer, the second polyimide layer being adhered in contact with the first polyimide layer, and a peeling strength between the first and second polyimide layers being less than a peeling strength between the first polyimide layer and the support base so that the second polyimide layer is peelable from the first polyimide layer while the first polyimide layer remains adhered in contact with the support base.

公开(公告)号：US20170107400A1

公开(公告)日：2017-04-20

申请号：US15293112

申请日：2016-10-13

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang

IPC: C09D179/08 ,  C08L79/08 ,  C08G73/10 ,  C09J179/08

CPC classification number: C09D179/08 ,  C08G73/1003 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/16 ,  C09J179/08

Abstract: A polyimide film structure includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer. The base layer includes a polyimide, and a filler made of a siloxane polymer present at a weight ratio between about 5 wt % and about 40 wt % based on the total weight of the base layer. Moreover, the present application also describes a method of fabricating the polyimide film structure, and its assembly on a substrate.

公开(公告)号：US10212821B2

公开(公告)日：2019-02-19

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  C03C17/34 ,  H01L21/683 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  H01L23/498 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

公开(公告)号：US20170298249A1

公开(公告)日：2017-10-19

申请号：US15131990

申请日：2016-04-18

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chih-Wei Lin ,  Chun-Ting Lai ,  Yen-Po Huang

IPC: C09D179/08

CPC classification number: C09D179/08 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/106

Abstract: The present disclosure relates, according to some embodiments, to a multilayered polyimide film comprising a peelable base layer, and a polyimide layer adhered in contact with the peelable base layer. A peelable base layer may be derived from a reaction comprising a diamine compound and a dianhydride compound, wherein the peelable base comprises a polyimide and a structure according to formula (I): wherein n is a number of repeating units. According to some embodiments, a quantity of silicon atoms present in a peelable base layer comprises about 1% to about 12% of a total weight of the peelable base layer.

公开(公告)号：US20170064838A1

公开(公告)日：2017-03-02

申请号：US15250595

申请日：2016-08-29

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Paul S.C. Wu ,  Chun-Ting Lai ,  Yen-Po Huang ,  Sheng-Yu Huang

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/007 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2203/0264

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

Abstract translation: 根据一些实施例，本公开涉及柔性电路板的制造，其包括形成包含聚酰亚胺的基层，在基层上形成聚酰亚胺层，所述聚酰亚胺层具有第一表面和与第二表面相对的第二表面 彼此之间，第一表面可剥离地与基底层接触，在聚酰亚胺层的第二表面上形成金属层，并且在聚酰亚胺层上剥离基底层，金属层残留在聚酰亚胺的第二表面上 层。