公开(公告)号：US20170056934A1

公开(公告)日：2017-03-02

申请号：US14839625

申请日：2015-08-28

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Yu-Young WANG ,  Chung-En KAO ,  Victor Y. LU

IPC分类号： B08B3/02 ,  C25D17/06 ,  C25D21/00 ,  B08B3/10 ,  B08B3/08

CPC分类号： B08B3/02 ,  B08B2203/0229 ,  C25D17/06 ,  C25D21/00

摘要： A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.

摘要翻译： 用于去除与电镀槽一起使用的衬底保持器上的污染的清洁装置包括臂，清洁剂供应器，喷嘴和接收器。 清洁剂供应商联接到臂并且构造成供应清洁剂。 喷嘴连接到清洁剂供应商并且被配置为将清洁剂喷射到基板保持器上以除去污染物。 接收器耦合到臂并且被配置为在将清洁剂喷射到基板保持器上之后接收清洁剂。