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公开(公告)号：US20240318346A1
公开(公告)日：2024-09-26
申请号：US18026774
申请日：2022-04-21
Applicant: EBARA CORPORATION
Inventor： Shinji OMATA , Masaki TOMITA , Kentaro YAMAMOTO , Yasuyuki MASUDA
CPC classification number: C25D17/002 , C25D17/02 , C25D17/06 , C25D21/04
Abstract: Provided is a technique that ensures suppressing deterioration of plating quality of a substrate due to gas bubbles at an anode.
A plating module 400 includes a plating tank 10 configured to house a plating solution, an anode 13 arranged in the plating tank 10, a substrate holder 20 configured to hold a substrate WF with a surface to be plated facing downward so as to be opposed to the anode 13, a membrane module 40 that includes a first membrane 41 partitioning an inside of the plating tank 10 into an anode chamber 11 and a cathode chamber 12 and a second membrane 42 arranged between the first membrane 41 and the anode 13, and a pipe member 31 communicating between a first region R1 below the anode 13 in the plating tank 10 and a second region R2 between the first membrane 41 and the second membrane 42.-
公开(公告)号：US20240247396A1
公开(公告)日：2024-07-25
申请号：US18017645
申请日：2022-06-17
Applicant: EBARA CORPORATION
Inventor： Masaki TOMITA , Masaya SEKI , Kentaro YAMAMOTO
Abstract: Provided is a technique that determines presence of a leakage of a plating solution to an arranged region of a contact member.
A leakage determination method includes: discharging step 120 of discharging a cleaning liquid to the contact member of a substrate holder after immersing a substrate held by the substrate holder in the plating solution and performing a plating process; a measuring step 122 of measuring a conductivity of the cleaning liquid after cleaning the contact member; and determining step 128 of determining presence or absence of a leakage of the plating solution to the arranged region of the contact member based on comparison between a first conductivity of a cleaning liquid measured in advance for a substrate holder serving as a reference and a second conductivity of the cleaning liquid measured in the measuring step 122.-
公开(公告)号：US20240218552A1
公开(公告)日：2024-07-04
申请号：US17923412
申请日：2021-11-04
Applicant: EBARA CORPORATION
Inventor： Kentaro YAMAMOTO , Masaki TOMITA , Kazuhito TSUJI
CPC classification number: C25D21/08 , C25D17/005 , C25D17/02 , C25D17/06
Abstract: A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.
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公开(公告)号：US20240209541A1
公开(公告)日：2024-06-27
申请号：US18427250
申请日：2024-01-30
Applicant: Snap-on Incorporated
Inventor： Kraig A. Tabor , Thomas L. Kassouf , Ricardo M. Guedes , Greg P. Formella , Alan J. Birschbach , Peter W. Eisch , Garry L. Dillon , Chad J. Kaschak , Michael G. Gentile
IPC: C25D21/08 , C25D5/08 , C25D17/00 , C25D17/02 , C25D17/04 , C25D17/06 , C25D17/08 , C25D17/10 , C25D21/10 , C25D21/12
CPC classification number: C25D21/08 , C25D5/08 , C25D17/00 , C25D17/02 , C25D17/04 , C25D17/06 , C25D17/08 , C25D17/10 , C25D21/10 , C25D21/12
Abstract: A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.
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公开(公告)号：US20240209538A1
公开(公告)日：2024-06-27
申请号：US17802400
申请日：2021-11-04
Applicant: EBARA CORPORATION
Inventor： Kentaro YAMAMOTO , Masaki TOMITA , Kazuhito TSUJI
CPC classification number: C25D17/06 , C25D17/004 , C25D17/02 , C25D21/08
Abstract: A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.
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Patent Agency Ranking
公开(公告)号：US11926920B2
公开(公告)日：2024-03-12
申请号：US17057981
申请日：2019-04-29
Applicant: ACM Research (Shanghai) Inc.
Inventor： Zhaowei Jia , Jian Wang , Hui Wang , Hongchao Yang
IPC: C25D5/18 , C25D7/12 , C25D17/00 , C25D17/06 , C25D17/12 , C25D21/12 , H01L21/288 , H01L21/687 , H01L23/544
CPC classification number: C25D5/18 , C25D7/12 , C25D17/001 , C25D17/06 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/68764 , H01L23/544 , H01L2223/54493
Abstract: Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, which comprising a plurality of electrodes, for forming electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. Embodiments of the present invention also provide an electroplating method for electroplating on a surface of a wafer, the method controlling the plurality of electrodes to form electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. The present invention is more accurate and reliable, the electroplating efficiency is also increased.
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公开(公告)号：US11905612B2
公开(公告)日：2024-02-20
申请号：US17859717
申请日：2022-07-07
Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
Inventor： Takeharu Naito , Osamu Hashiguchi , Yumiko Kobori , Akifumi Nakamura , Yosuke Honda , Masanori Takahashi
Abstract: In a plating method for mounting a tubular workpiece having openings at both ends in an axial direction thereof on a power feeding clip and immersing the tubular workpiece in a circulated plating solution to plate the tubular workpiece, the mounting of the tubular workpiece on the power feeding clip is performed by inserting the power feeding clip into the tubular workpiece from one of the openings of the tubular workpiece. The power feeding clip is configured by a folded metal plate, and includes a plurality of elastic contact pieces that can elastically contact the inner surface of the tubular workpiece to hold the tubular workpiece and supply power to the tubular workpiece, and a restraining part that is located inside the tubular workpiece and restrains flow of the plating solution in the axial direction.
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公开(公告)号：US11891714B2
公开(公告)日：2024-02-06
申请号：US17060375
申请日：2020-10-01
Applicant: C. Uyemura & Co., Ltd.
Inventor： Daisuke Matsuyama , Daisuke Hashimoto , Kazuyoshi Nishimoto , Tomoji Okuda
Abstract: A holding apparatus for applying an electrolytic plating treatment to a planar workpiece, and the holding apparatus can reduce an amount of plating that is deposited on an edge part of the planar workpiece. The holding apparatus for applying the electrolytic plating treatment to the planar workpiece has a rear member and a front member facing the rear member and having an opening part. The planar workpiece is disposed between the rear member and the front member. The front member has a plurality of electrodes and a plurality of first insulating parts. The plurality of electrodes and the plurality of first insulating parts cover the edge part of the planar workpiece in a width direction of the planar workpiece.
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公开(公告)号：US11891713B2
公开(公告)日：2024-02-06
申请号：US17412173
申请日：2021-08-25
Inventor： Takeyuki Suzuki
CPC classification number: C25D17/001 , C25D7/123 , C25D17/004 , C25D17/005 , C25D17/06
Abstract: A semiconductor device manufacturing jig for electroplating a substrate includes a conductive member. The substrate includes an inner part including a first surface, and an outer rim part surrounding the inner part. The outer rim part has a ring shape that protrudes further than the first surface in a direction perpendicular to the first surface. The conductive member causes a current to flow in the inner part by contacting a portion of the first surface of the inner part without contacting the outer rim part.
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公开(公告)号：US20230279579A1
公开(公告)日：2023-09-07
申请号：US18086319
申请日：2022-12-21
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Masashi SHIMOYAMA , Masashi OBUCHI , Koichi MASUYA
CPC classification number: C25D21/12 , C25D17/007 , C25D17/06
Abstract: Provided is a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, and an anode disposed in the plating tank to oppose the substrate held by the substrate holder. The plating apparatus also includes a conduit having a first portion including an opening end disposed in a region between the substrate held by the substrate holder and the anode, and a second portion apart from the region between the substrate held by the substrate holder and the anode, the conduit having at least a part filled with a plating solution, and a potential sensor that is disposed in the second portion of the conduit and that is configured to measure a potential of the plating solution.
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