Light source module and display device

    公开(公告)号:US12237363B2

    公开(公告)日:2025-02-25

    申请号:US17622816

    申请日:2021-12-17

    Abstract: A light source module and a display device include a substrate configured to have a plurality of light-emitting regions arranged in an array manner, each light-emitting region is provided with two light-emitting groups, each light-emitting group includes a plurality of light-emitting branches arranged side by side, and two driving chips are disposed in parallel between the two light-emitting groups; and single-layer layout wiring arranged on the substrate, wherein the single-layer layout wiring couples the driving chips within the light-emitting regions to each other and electrically connects each of the driving chips to the light-emitting branches within one of the light-emitting groups.

    LIGHT SOURCE MODULE AND DISPLAY DEVICE
    3.
    发明公开

    公开(公告)号:US20240030273A1

    公开(公告)日:2024-01-25

    申请号:US17622816

    申请日:2021-12-17

    CPC classification number: H01L27/156 H01L33/62

    Abstract: A light source module and a display device include a substrate configured to have a plurality of light-emitting regions arranged in an array manner, each light-emitting region is provided with two light-emitting groups, each light-emitting group includes a plurality of light-emitting branches arranged side by side, and two driving chips are disposed in parallel between the two light-emitting groups; and single-layer layout wiring arranged on the substrate, wherein the single-layer layout wiring couples the driving chips within the light-emitting regions to each other and electrically connects each of the driving chips to the light-emitting branches within one of the light-emitting groups.

    Backlight source and display device

    公开(公告)号:US12164197B2

    公开(公告)日:2024-12-10

    申请号:US17622802

    申请日:2021-12-17

    Abstract: A backlight source and a display device are provided. The display panel includes the plurality of stacked metal sub-layers and the first passivation sub-layer and the second passivation sub-layer stacked. The first passivation sub-layer is disposed between the metal layer and the second passivation layer. Material of the first passivation sub-layer includes silicon nitride. The first passivation sub-layer covers the untidy area at the ends of the molybdenum-titanium alloy thin layer to avoid from detachment of the passivation layer, and meanwhile to solve the issues of simplifying the manufacturing process of the display panel, and to avoid from oxidation of the bonding pads.

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