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公开(公告)号：US20240363818A1
公开(公告)日：2024-10-31
申请号：US18572064
申请日：2021-06-30
申请人： LG ELECTRONICS INC.
发明人： Jeonghyo KWON , Wonseok CHOI , Junoh SHIN , Sungmin PARK
CPC分类号： H01L33/62 , H01L25/167
摘要： The display device can comprise a first wiring, a second wiring disposed on a different layer from the first wiring, a pad disposed on the same layer as the second wiring and that vertically overlaps the first wiring, and on the pad and the second wiring. It is disposed and can comprise an insulating layer having an assembly hole, and a semiconductor light emitting device disposed on a pad and a second wiring within the assembly hole. The embodiment prevents separation of the semiconductor light emitting device, improves the light efficiency of the semiconductor light emitting device to implement high luminance, and significantly improves light efficiency, thereby implementing further improved high resolution.
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公开(公告)号：US20240363812A1
公开(公告)日：2024-10-31
申请号：US18637232
申请日：2024-04-16
申请人： NICHIA CORPORATION
发明人： Tatsuya HAYASHI , Shinya OKURA
IPC分类号： H01L33/50 , H01L25/075 , H01L33/52 , H01L33/62
CPC分类号： H01L33/504 , H01L25/0753 , H01L33/52 , H01L33/62
摘要： A light-emitting device includes a light-emitting element, a wavelength conversion layer, and a light-transmissive layer. The light-emitting element has a light exit surface. The wavelength conversion layer has a lower surface and an upper surface. The wavelength conversion layer is disposed on or above the light-emitting element so that the lower surface of the wavelength conversion layer faces the light exit surface of the light-emitting element. The wavelength conversion layer includes a first layer and a second layer. The first layer contains a first phosphor particle, and constitutes a part of the upper surface and a part of the lower surface of the wavelength conversion layer. The second layer contains a second phosphor particle and a light-reflective particle, and constitutes a part of the upper surface and a part of the lower surface of the wavelength conversion layer. The light-transmissive layer is disposed on or above the wavelength conversion layer.
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公开(公告)号：US20240363798A1
公开(公告)日：2024-10-31
申请号：US18028791
申请日：2022-04-25
发明人： Jingjing ZHANG , Can ZHANG , Can WANG , Wei LI , Jinfei NIU , Ning CONG
CPC分类号： H01L33/20 , H01L33/382 , H01L33/505 , H01L33/62 , H01L2933/0016 , H01L2933/0041
摘要： A light-emitting diode chip includes: epitaxial structures on one side of substrate, a gap existing between any two adjacent epitaxial structures, first semiconductor patterns of epitaxial structures coupled to form first semiconductor layer; first light-blocking layer on a side of the first semiconductor layer away from substrate, first light-blocking layer having accommodating holes in one-to-one correspondence with epitaxial structures, the light-emitting patterns and the second semiconductor patterns of epitaxial structures being in accommodating holes; second light-blocking layer on a side of first light-blocking layer away from substrate, second light-blocking layer having pixel openings in one-to-one correspondence with accommodating holes; orthographic projections of pixel opening and corresponding accommodating hole on substrate overlap with each other; light processing pattern is in at least one pixel opening; light processing pattern includes color conversion pattern configured to convert light of preset color emitted by light-emitting pattern into light of other color.
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公开(公告)号：US20240363674A1
公开(公告)日：2024-10-31
申请号：US18410856
申请日：2024-01-11
发明人： Su Jeong KIM , Dae Hong MIN
IPC分类号： H01L27/15 , H01L25/075 , H01L33/20 , H01L33/62
CPC分类号： H01L27/156 , H01L25/0753 , H01L33/20 , H01L33/62
摘要： The present disclosure relates to a light-emitting element structure and a display device. According to one or more embodiments, the display device includes a growth substrate, light-emitting elements including a first light-emitting element for emitting light of a first wavelength and a second light-emitting element for emitting light of a second wavelength on the growth substrate, and including current-spreading layers including a first current-spreading layer having a first width on the first light-emitting element and a second current-spreading layer having a second width that is less than the first width on the second light-emitting element, and an insulating layer between the light-emitting elements.
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公开(公告)号：US20240363392A1
公开(公告)日：2024-10-31
申请号：US18765940
申请日：2024-07-08
发明人： Daihua Zhang , Yingdong Luo , Mingwei Zhu , Hou T. Ng , Sivapackia Ganapathiappan , Nag B. Patibandla
IPC分类号： H01L21/70 , H01L21/02 , H01L21/027 , H01L25/075 , H01L27/15 , H01L33/00 , H01L33/44 , H01L33/50 , H01L33/58 , H01L33/62
CPC分类号： H01L21/70 , H01L21/02104 , H01L21/027 , H01L21/707 , H01L25/0753 , H01L27/153 , H01L33/00 , H01L33/0093 , H01L33/44 , H01L33/505 , H01L33/58 , H01L33/62 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
摘要： A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a color conversion layer over each of a plurality of light emitting diodes, and a plurality of isolation walls separating adjacent micro-LEDs of the array.
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公开(公告)号：US12132160B2
公开(公告)日：2024-10-29
申请号：US17615075
申请日：2020-11-04
发明人： Yingwei Liu , Zhanfeng Cao , Zhiwei Liang , Ke Wang , Muxin Di , Shuang Liang , Yankai Gao
IPC分类号： H01L33/62 , G09F9/302 , H01L25/075 , H01L33/00 , H01L33/38
CPC分类号： H01L33/62 , G09F9/3026 , H01L25/0753 , H01L33/005 , H01L33/387 , H01L2933/0016 , H01L2933/0066
摘要： A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.
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公开(公告)号：US12132159B2
公开(公告)日：2024-10-29
申请号：US17567671
申请日：2022-01-03
发明人： Jongho Lim , Myoungsu Chae , Yeonjun Sung , Hyongsik Won , Joonwoo Jeon , Soonwon Jeong
摘要： A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.
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公开(公告)号：US20240355992A1
公开(公告)日：2024-10-24
申请号：US18763646
申请日：2024-07-03
申请人： CreeLED, Inc.
IPC分类号： H01L33/62 , H01L27/15 , H05B45/325
CPC分类号： H01L33/62 , H01L27/156 , H05B45/325
摘要： Synchronization for light emitting diode (LED) pixels in an LED display is provided so that one or more actions of all LED pixels are able to be initiated at the same time, or within a millisecond. LED displays and corresponding systems may include a controller that is configured for sending communication signals to one or more strings of LED pixels. Active electrical elements within each LED pixel may be configured to receive the communication signals, generate corresponding synchronization signals, and respond in a manner that is coordinated with all other LED pixels in a particular LED display. Failure mitigation of LED pixel failures within an LED string is provided where the controller is configured with bidirectional communication ports for communication with the LED string. In a failure mitigation process, the bidirectional communication ports may switch directions to provide communication signals to both sides of an LED string.
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9.发明公开公开(公告)号：US20240355988A1
公开(公告)日：2024-10-24
申请号：US18757554
申请日：2024-06-28
发明人： Yingying WU
CPC分类号： H01L33/62 , H01L25/167 , H01L2933/0066
摘要： A display panel, a method for repairing thereof, and a display device. The display panel includes multiple electrode groups including an initial electrode and a redundant electrode. The initial electrode includes a first electrode, an intermediate electrode and a second electrode, which form a first initial electrode pair and a second initial electrode pair. Light-emitting devices connected to the above initial electrode pairs are connected in series; the redundant electrode includes a first redundant electrode, an intermediate redundant electrode and a second redundant electrode, which form a first redundant electrode pair and a second redundant electrode pair; and/or, which form a third redundant electrode pair; the first redundant electrode and the first electrode have the same electric potential, the intermediate redundant electrode and the intermediate electrode have the same electric potential, and the second redundant electrode and the second electrode have the same electric potential.
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公开(公告)号：US20240355986A1
公开(公告)日：2024-10-24
申请号：US18633418
申请日：2024-04-11
发明人： Shiou-Yi KUO , Guo-Yi SHIU , Chin-Hung LO , Chih-Hao LIN , Cheng-Hsien LI , Wei-Yuan MA
IPC分类号： H01L33/62 , H01L23/00 , H01L25/075
CPC分类号： H01L33/62 , H01L24/19 , H01L24/20 , H01L25/0753 , H01L2224/19 , H01L2224/211 , H01L2933/0066
摘要： A micro light-emitting diode package structure and a forming method thereof are provided. The micro light-emitting diode package structure includes micro light-emitting diode dies, a light-transmitting layer, a first insulating layer, redistribution layers, and conductive elements. The micro light-emitting diode dies are disposed side by side and each includes an electrode surface, a light-emitting surface, and side surfaces. The electrode surface and the light-emitting surface are opposite to each other, and the side surfaces are between them. The light-transmitting layer covers the light-emitting surface and the side surfaces. The first insulating layer is under the micro light-emitting diode dies and in direct contact with the electrode surface. The redistribution layers are disposed under the first insulating layer and pass through the first insulating layer to electrically connect the electrode surface. The conductive elements are disposed under the redistribution layers and electrically connected to the redistribution layers.
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