公开(公告)号：US20230093241A1

公开(公告)日：2023-03-23

申请号：US17909080

申请日：2021-03-04

Applicant: TDK CORPORATION

Inventor： Hiroshi KOIZUMI ,  Yasuo KATO ,  Makoto YAMASHITA ,  Mitsuyoshi MAKIDA ,  Ryo SHINDO ,  Osamu SHINDO ,  Hiroshi IIZUKA ,  Seijiro SUNAGA ,  Toshinobu MIYAGOSHI

IPC: H01L33/00

Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.