公开(公告)号：US20230381904A1

公开(公告)日：2023-11-30

申请号：US18323618

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Toshinobu MIYAGOSHI ,  Osamu SHINDO ,  Seijiro SUNAGA ,  Makoto YAMASHITA ,  Yasuo KATO ,  Mitsuyoshi MAKIDA ,  Masashi MATSUMOTO

IPC: B23Q3/02

CPC classification number: B23Q3/02

Abstract: A substrate processing apparatus 10 having a lower jig plate 46 for arranging a substrate 2 as an object to be pressurized, a support member 45 including an installation portion 52 for installing columnar members 50 supporting the lower jig plate 46, in which the columnar members 50 are placed to the installation portion 52 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.

公开(公告)号：US20230140856A1

公开(公告)日：2023-05-11

申请号：US17915349

申请日：2021-03-30

Applicant: TDK CORPORATION

Inventor： Seijiro SUNAGA ,  Makoto YAMASHITA ,  Toshinobu MIYAGOSHI ,  Yasuo KATO ,  Tatsunori OTOMO ,  Mitsuyoshi MAKIDA ,  Yohei SATO

IPC: H01L21/67 ,  H01L21/68 ,  B65G47/90 ,  B41K3/64

CPC classification number: H01L21/67132 ,  H01L21/681 ,  B65G47/90 ,  B41K3/64

Abstract: A stamp tool holding device capable of holding a stamp tool while keeping a stamp surface of the stamp tool clean, a stamp tool positioning device that easily positions a stamp tool with respect to a transport head, a multi-element transfer device for efficiently transferring a transport object element such as an element using a stamp tool, and a method of manufacturing an element array using the same, wherein the stamp tool holding device has an installation stage on which a stamp tool is detachably installed. The installation stage has an installation surface on which a housing recess for accommodating a stamp layer of the stamp tool is formed, and a suction hole capable of detachably adsorbing a part of the stamp tool located around the stamp layer is formed on the installation surface.

公开(公告)号：US20230093241A1

公开(公告)日：2023-03-23

申请号：US17909080

申请日：2021-03-04

Applicant: TDK CORPORATION

Inventor： Hiroshi KOIZUMI ,  Yasuo KATO ,  Makoto YAMASHITA ,  Mitsuyoshi MAKIDA ,  Ryo SHINDO ,  Osamu SHINDO ,  Hiroshi IIZUKA ,  Seijiro SUNAGA ,  Toshinobu MIYAGOSHI

IPC: H01L33/00

Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.

公开(公告)号：US20200001391A1

公开(公告)日：2020-01-02

申请号：US16455237

申请日：2019-06-27

Applicant: TDK CORPORATION

Inventor： Seijiro SUNAGA ,  Toshinobu MIYAGOSHI ,  Tatsunori OTOMO

IPC: B23K20/10

Abstract: An ultrasonic bonding head includes a vibrator unit, a holder, and a pressurizing shaft. The vibrator unit includes a press part formed at a tip of the vibrator unit in a longitudinal axis thereof and configured to press a bonding scheduled part to be bonded. The holder holds a base of the vibrator unit in a cantilever manner so that the tip is a free end. The pressurizing shaft is connected with the holder and transmits a force of pressing the press part against the bonding scheduled part so that the vibrator unit moves substantially perpendicularly to the longitudinal axis. The holder is provided with a restraint portion. The restraint portion contacts with the vibrator unit at a counterforce dispersion position located between a main hold position for holding the vibrator unit by the holder and the free end.

公开(公告)号：US20230382070A1

公开(公告)日：2023-11-30

申请号：US18323745

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Toshinobu MIYAGOSHI ,  Osamu SHINDO ,  Seijiro SUNAGA ,  Mitsuyoshi MAKIDA ,  Makoto YAMASHITA ,  Yasuo KATO ,  Ryo SHINDO ,  Masashi MATSUMOTO

IPC: B30B12/00 ,  B30B15/04 ,  B30B15/06

CPC classification number: B30B12/00 ,  B30B15/062 ,  B30B15/04

Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.

公开(公告)号：US20230187258A1

公开(公告)日：2023-06-15

申请号：US17915320

申请日：2021-03-30

Applicant: TDK CORPORATION

Inventor： Seijiro SUNAGA ,  Makoto YAMASHITA ,  Toshinobu MIYAGOSHI ,  Yasuo KATO ,  Tatsunori OTOMO ,  Mitsuyoshi MAKIDA ,  Yohei SATO

IPC: H01L21/683 ,  H05K13/04 ,  H01L21/67 ,  H01L21/687 ,  B29C59/02

CPC classification number: H01L21/6838 ,  B29C59/026 ,  H01L21/67144 ,  H01L21/68707 ,  H05K13/0404 ,  B29L2007/00

Abstract: [Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same.
[Solution] A stamp tool 10 includes a stamp layer 12 allowing an element 32r as an transport object element to detachably adhere thereto, a support plate 14 to which the stamp layer 12 is fixed, and an adapter plate 16 having a mounting surface 16a, the support plate 14 being replaceably attached thereto, and a transport head 22 being allowed to be detachably attached thereon.

公开(公告)号：US20200227468A1

公开(公告)日：2020-07-16

申请号：US16713513

申请日：2019-12-13

Applicant: TDK CORPORATION

Inventor： Toshinobu MIYAGOSHI ,  Seijiro SUNAGA ,  Osamu SHINDO ,  Yasuo KATO

IPC: H01L27/15 ,  C09J201/00 ,  H01L33/00

Abstract: In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.

公开(公告)号：US20200215809A1

公开(公告)日：2020-07-09

申请号：US16713763

申请日：2019-12-13

Applicant: TDK CORPORATION

Inventor： Toshinobu MIYAGOSHI ,  Seijiro SUNAGA ,  Osamu SHINDO ,  Yasuo KATO

IPC: B32B43/00 ,  H01L21/67

Abstract: An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.