公开(公告)号：US11082028B2

公开(公告)日：2021-08-03

申请号：US16724681

申请日：2019-12-23

Applicant: Texas Instruments Incorporated

Inventor： James Cooper Wainerdi ,  Luu Nguyen ,  Alexander Harvey Scheuermann ,  Matthew David Romig

IPC: H03H9/10 ,  H01L23/495 ,  H01L23/31 ,  B81B7/00 ,  H01L23/18 ,  B29C64/00 ,  B33Y80/00 ,  H01L21/02 ,  H01L23/433 ,  H01L41/053 ,  H01L41/23

Abstract: In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.

公开(公告)号：US10516381B2

公开(公告)日：2019-12-24

申请号：US15858892

申请日：2017-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： James Cooper Wainerdi ,  Luu Nguyen ,  Alexander Harvey Scheuermann ,  Matthew David Romig

IPC: H03H9/10 ,  H01L23/495 ,  H01L23/31 ,  B81B7/00 ,  H01L23/18 ,  B33Y80/00 ,  H01L21/02 ,  H01L41/053 ,  H01L41/23 ,  B29C64/00

Abstract: In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.