公开(公告)号：US20240006273A1

公开(公告)日：2024-01-04

申请号：US17854526

申请日：2022-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Kumar Anurag SHRIVASTAVA ,  Arushi AGRAWAL

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L23/49575 ,  H01L21/4821 ,  H01L24/48 ,  H01L2224/48245 ,  H01L2924/1431 ,  H01L2924/30107

Abstract: An example packaged IC includes a lead frame having a supply pin and a ground pin. The supply pin includes first and second supply leads extending from a proximal portion of the supply pin. The ground pin includes first and second ground leads extending from a proximal portion of the ground pin. A first IC network has a first supply terminal coupled to the first supply lead via a first conductor (e.g., bond wire or bump bond). The first IC network also has a first ground terminal coupled to the first ground lead via a second conductor. A second IC network has a second supply terminal coupled to the second supply lead via a third conductor. The second IC network also has a second ground terminal coupled to the second ground lead via a fourth conductor.