公开(公告)号：US20240055327A1

公开(公告)日：2024-02-15

申请号：US17818395

申请日：2022-08-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Makoto Yoshino ,  Hiroki Kawano ,  Hau Nguyen

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/4951 ,  H01L23/49555 ,  H01L21/4842

Abstract: A method for making a semiconductor device is provided. The method generally includes forming a package having a first plurality of leads extending from a first side of the package, the package disposed on a leadframe. The method generally includes making a first cut adjacent to a first side of a first lead of the first plurality of leads, the first side extending from the first side of the package. The method generally includes making a second cut adjacent to a second side of the first lead of the first plurality of the lead, the second side of the lead opposite the first side of the lead and extending from the first side of the package.