公开(公告)号：US11152068B2

公开(公告)日：2021-10-19

申请号：US16823414

申请日：2020-03-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Xiang-Zheng Bo ,  Patrick R. Smith ,  Douglas T. Grider

IPC: H01L29/78 ,  G11C16/04 ,  H01L27/1156 ,  H01L27/108 ,  H01L27/118

Abstract: In some examples, an integrated circuit comprises a first plate, a second plate, and a dielectric layer disposed between the first and second plates, the first and second plates and the dielectric layer forming a vertical capacitor, wherein the first and second plates and the dielectric layer of the vertical capacitor are disposed on an isolation region of the integrated circuit.