公开(公告)号：US20250096189A1

公开(公告)日：2025-03-20

申请号：US18385694

申请日：2023-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chen Chao ,  Bo Jiang ,  Wei Li ,  Jie Chen ,  Ruijie Huang ,  Liang Zheng ,  Qi Ming Bao ,  Bin Liu

IPC: H01L23/00 ,  B23K3/06

Abstract: An integrated circuit (IC) solder ball mounting apparatus comprises a ball storage unit for storing solder balls, a ball buffer unit configured to receive the solder balls from the ball storage unit in response to one or more pressure-actuated actions, and a gate valve configured to allow the solder balls to transfer to a ball mounting brush configured to place the solder balls onto area array contact structures formed on a wafer containing the integrated circuit.