公开(公告)号：US20190198352A1

公开(公告)日：2019-06-27

申请号：US15853345

申请日：2017-12-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Amit Sureshkumar NANGIA ,  Siva Prakash GURRUM ,  Janakiraman SEETHARAMAN

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/495 ,  H01L23/50 ,  H01L23/64 ,  H01L23/522 ,  H01L23/00 ,  C08G59/18

CPC classification number: H01L21/565 ,  C08G59/18 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/50 ,  H01L23/5223 ,  H01L23/562 ,  H01L23/642 ,  H01L24/03

Abstract: A semiconductor package includes an integrated circuit formed on a semiconductor substrate. A stress buffer layer is provided on the integrated circuit. Further, a mold compound is provided on a surface of the stress buffer layer opposite the integrated circuit. The mold compound comprises a resin. The resin includes filler particles. The filler particles have multiple sizes with the largest of the particles having a size between 5 microns and 32 microns.