公开(公告)号：US20250069976A1

公开(公告)日：2025-02-27

申请号：US18455163

申请日：2023-08-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Vernon BUCK ,  Katleen Fajardo TIMBOL ,  Jeffrey SOLAS

IPC: H01L23/31 ,  G01N27/22 ,  H01L21/56 ,  H01L23/00 ,  H01L23/24

Abstract: An electronic device includes a substrate and a die having an active surface disposed on the substrate. A sensor is in communication with the active surface of the die and a ring is disposed on the die and encircles the sensor. The ring includes a cylindrical wall and a cap, where the cylindrical wall has an open top and the cap has a partial circular shape that extends beyond each side of the cylindrical wall, A cover is disposed on the cap such that the cover closes off the open top of the ring to form a cavity inside the ring to prevent foreign substance from entering the cavity. A mold compound covers the die and the cover, and abuts an outer surface of the cylindrical wall.