公开(公告)号：US20240071837A1

公开(公告)日：2024-02-29

申请号：US17897688

申请日：2022-08-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bin Liu ,  Lin Lin ,  Yu Chen Li ,  Si Si Xie ,  Zhi Yun Liu ,  Bo Jiang

IPC: H01L21/66

CPC classification number: H01L22/10 ,  H01L22/20

Abstract: A wafer metrology system having a continuous dynamic sampling scheme configured to optimize a sampling rate for AVI of process wafers in an IC fabrication flow based on acceptable quality levels. For a stable process, the process wafers may be sampled at a lower rate without negatively affecting quality control.