公开(公告)号：US20150339567A1

公开(公告)日：2015-11-26

申请号：US14647746

申请日：2013-11-28

Applicant: TOPPAN FORMS CO., LTD.

Inventor： Nobuyuki Hirasaki ,  Yuya Takahashi ,  Hitoshi Kagaya

IPC: G06K19/077 ,  H01Q1/22 ,  G06K7/10 ,  H01Q21/00

CPC classification number: G06K19/07794 ,  G06K7/10009 ,  G06K19/0723 ,  G06K19/07758 ,  H01Q1/2225 ,  H01Q9/26 ,  H01Q21/0087 ,  Y10T29/4902

Abstract: A radio IC-mounted article communicates in a microwave band or an ultrahigh frequency band, and is provided with: a substrate on which an IC chip and an antenna electrically connected to the IC chip are mounted; a first booster antenna electromagnetically coupled to the antenna; a second booster antenna electromagnetically coupled to the first booster antenna; and an article on which the substrate, the first booster antenna, and the second booster antenna are mounted.

Abstract translation: 无线IC安装物品在微波频带或超高频段中通信，并且设置有：其上安装IC芯片和与IC芯片电连接的天线的基板; 电磁耦合到天线的第一增强天线; 电磁耦合到第一增强天线的第二增强天线; 以及其上安装有基板，第一增强天线和第二增强天线的物品。