公开(公告)号：US12067439B2

公开(公告)日：2024-08-20

申请号：US18079172

申请日：2022-12-12

Applicant: TOPPAN INC.

Inventor： Yukiko Katano ,  Tetsuya Tsukada ,  Shinji Kaneko ,  Shigeki Minemura

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/0775 ,  G06K19/0718 ,  G06K19/07745 ,  G06K19/07773

Abstract: A card-type medium includes: a card body; an internal component embedded in the card body; an exposed component partially exposed on a front surface of the card body; and a circuit board to which the internal component and the exposed component are bonded, wherein the circuit board includes a first connection portion to which the internal component is bonded, a second connection portion to which the exposed component is bonded, the second connection portion being located at a position different from the first connection portion in a card thickness direction connecting the front surface of the card body and a rear surface on an opposite side of the card body to the front surface, and a connection wiring portion that connects the first connection portion and the second connection portion, the connection wiring portion extending in a direction including the card thickness direction.

公开(公告)号：US12260278B2

公开(公告)日：2025-03-25

申请号：US18221279

申请日：2023-07-12

Applicant: TOPPAN INC.

Inventor： Eriko Uehara ,  Yukiko Katano ,  Shigeki Minemura

IPC: G06K19/077 ,  G06K19/07 ,  H05K1/09 ,  H05K1/18

Abstract: A card-type medium includes a card body; an exposed component that is accommodated inside an opening formed in a front surface of the card body and is disposed so as to be partially exposed on the front surface; and a circuit board that is embedded in the card body and to which the exposed component is attached. The exposed component includes a first exposed component that is attached to the circuit board with an intermediate spacer interposed therebetween. The first exposed component and the intermediate spacer are joined together by a first conductive joining material. The circuit board and the intermediate spacer are joined together by a second conductive joining material. A joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material are different from each other.